Semiconductor News & Analysis Feed

Samsung Electronics could overtake SK Hynix in the global high-bandwidth memory (HBM) market in 2027, driven by the competitive edge of HBM4, the sixth generation of HBM. Market watchers also expect Samsung to expand 1c DRAM production for HBM4 while raising the latter's prices in 2027 to boost both market share and profitability.

SEOUL, June 9 (Reuters) - Samsung Electronics is considering the construction of an advanced semiconductor packaging facility in the southwestern South Korean city of Gwangju, the Korea Economic Daily said on Tuesday. Here are some details: Samsung is expected to unveil the investment plan at a meeting between South Korean President Lee Jae Myung and the heads of the country’s largest conglomera

Samsung Electronics signaled that discussions on cooperation with Nvidia are progressing smoothly, and that collaboration in next-generation memory and foundry services will continue to expand. The comment was made by Samsung Electronics co-CEO and head of the Device Solutions (DS) division Young-hyun Jun following talks with Nvidia CEO Jensen Huang and senior executives at The Shilla hotel in Jun