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CanSemi Technology's planned ChiNext listing has exposed the financial strain behind China's push to build mature-node semiconductor capacity, as the Guangzhou-based foundry seeks fresh capital despite persistent losses, negative gross margins and a long road to profitability.

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As demand for high-performance AI chips rises, competition for 3nm and below fabrication capacity, along with advanced packaging technologies such as 2.5D and 3D integration, is becoming increasingly intense.One of the most persistent bottlenecks has been in advanced packaging, especially chip-on-wafer-on-substrate (CoWoS) technology. Shortages have extended beyond fabrication itself, affecting up