29 articles
2026-05-23
www.foreignpolicyjournal.com 2026-05-23 foreignpolicyjournal.com
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2026-05-23
digitimes.com 2026-05-23
CXMT's planned Shanghai listing is becoming more than a test of investor appetite for China's top DRAM maker. It is also putting a spotlight on whether the company's next phase of expansion can accelerate China's push to localize semiconductor equipment and materials.
2026-05-22
digitimes.com 2026-05-22
Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology has drawn significant industry attention. Global semiconductor equipment manufacturer Lam Research announced the official establishment of its PLP Center of Excellence (CoE) in Salzburg, Austria, aimed at streng
2026-05-21
www.benzinga.com 2026-05-21 Benzinga
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2026-05-20
247wallst.com 2026-05-20 24/7 Wall St.
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2026-05-20
www.benzinga.com 2026-05-20 Benzinga
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2026-05-18
www.benzinga.com 2026-05-18 Benzinga
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2026-05-18
digitimes.com 2026-05-18
China's semiconductor equipment localization campaign is entering a more demanding phase, shifting from proving that domestic alternatives can work to showing they can meet the reliability, throughput, and yield requirements of production-scale manufacturing.
2026-05-15
www.benzinga.com 2026-05-15 Benzinga
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2026-05-15
digitimes.com 2026-05-15
Applied Materials delivered record revenue and earnings in its second fiscal quarter of fiscal 2026, signaling a robust expansion in the semiconductor equipment market driven by the global build-out of artificial intelligence (AI) infrastructure.
2026-05-15
www.wsj.com 2026-05-15 WSJ
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2026-05-14
www.benzinga.com 2026-05-14 Benzinga
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2026-05-14
www.benzinga.com 2026-05-14 Benzinga
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2026-05-13
finance.yahoo.com 2026-05-13 Yahoo Finance
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2026-05-13
finance.yahoo.com 2026-05-13 Yahoo Finance
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2026-05-13
consent.yahoo.com 2026-05-13 Yahoo Finance
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2026-05-13
consent.yahoo.com 2026-05-13 Yahoo Finance
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2026-05-13
consent.yahoo.com 2026-05-13 Yahoo Finance
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2026-05-13
digitimes.com 2026-05-13
South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging (FO-PLP) equipment for advanced chip packaging in the second half of 2026, with the systems expected to be used in the mass production of networking chips for SpaceX.
2026-05-12
www.benzinga.com 2026-05-12 Benzinga
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