Semiconductor News & Analysis Feed
27 articles
2026-07-06
digitimes.com
2026-07-06
Asahi Kasei, one of the notable suppliers of Sunfort dry film photoresist in Japan, has initiated a fab expansion project in Taiwan. The newly established plant is expected to further elevate capacity performance in cutting and processing semiconductor packaging substrates.
2026-07-01
www.indexbox.io
2026-07-01
IndexBox
2026-06-29
digitimes.com
2026-06-29
Kyocera is committing JPY650 billion (approx. US$4 billion) to its components businesses through fiscal 2031, as AI data center investment and semiconductor equipment spending lift demand for ceramic parts, optical communication packages, and advanced semiconductor packaging materials.
2026-06-29
digitimes.com
2026-06-29
ShunSin Technology Holdings, Foxconn's semiconductor packaging and testing subsidiary, is accelerating its transition toward co-packaged optics (CPO). The company's latest appointment of a former TSMC executive as an independent director by Chairman Chiang Shang-yi has also drawn industry attention to the commercialization progress of its high-speed optical transceiver business.
2026-06-28
digitimes.com
2026-06-28
LG Chem is discussing whether to expand production of copper-clad laminate, or CCL, a core material used in semiconductor packaging, as demand tied to artificial intelligence chips accelerates, Herald Businessreported.
2026-06-28
www.insidermonkey.com
2026-06-28
Insider Monkey
NEWS
Taiwan Semiconductor (TSM), Amkor (AMKR) Form 10-Year Partnership for Advanced Semiconductor Packaging in Arizona
Published on June 27, 2026 at 12:15 pm by MAHAM FATIMA in News
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Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) is one of the best future stocks to buy and hold for 10 years. On June 16, TSMC and Amkor Technology entered into a 10-year partnership to expand adv
2026-06-28
finance.yahoo.com
2026-06-28
Yahoo Finance
Taiwan Semiconductor (TSM), Amkor (AMKR) Form 10-Year Partnership for Advanced Semiconductor Packaging in Arizona
Maham Fatima
June 27, 2026 2 min read
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TSM
+4.06%
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Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) is one of the best future stocks to buy and hold for 10 years. On June 16, TSMC and Amkor Technology
2026-06-27
digitimes.com
2026-06-27
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply global foundry and OSAT customers, ETNewsand Yonhapreported.
2026-06-25
digitimes.com
2026-06-25
The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing close market attention to how the rivalry with ASE and Amkor will reshape market share. ASE Chief Operating Officer Tien Wu said he is "optimistic," stating that strong demand from US customers and the need to divers
2026-06-23
digitimes.com
2026-06-23
Taiwan's semiconductor packaging and testing (OSAT) industry delivered strong year-over-year revenue growth in May 2026, with 21 of 24 tracked companies posting positive year-over-year gains, according to monthly revenue filings compiled for the period. The results underscore continued downstream demand driven by AI-related chip shipments and a broader recovery in consumer electronics.
2026-06-22
digitimes.com
2026-06-22
The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving faster in headlines than in production lines. DIGITIMEShas been tracking the latest developments in TSMC's CoPoS advanced packaging technology, with glass core substrates emerging as the most closely watched variable in that story.
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants, according to The Elecand Hankyung, citing industry sources, as the two companies look for ways to add back-end capacity beyond their existing manufacturing hubs.
2026-06-17
www.indexbox.io
2026-06-17
IndexBox
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2026-06-17
digitimes.com
2026-06-17
Taiwan Semiconductor Manufacturing Company (TSMC) and Amkor Technology have signed a 10-year agreement to jointly expand advanced semiconductor packaging capacity in Arizona, a move that would bring a more complete chip supply chain onto American soil.
2026-06-17
digitimes.com
2026-06-17
The global appetite for AI chips is putting new strain on materials suppliers, turning one of Ajinomoto's lesser-known products into a pressure point for advanced semiconductor packaging.
2026-06-10
digitimes.com
2026-06-10
Samsung Electronics is considering building an advanced semiconductor packaging facility in the southwestern city of Gwangju, a move that would expand its backend chipmaking footprint as demand for high-bandwidth memory and AI-related chips grows.
2026-06-08
digitimes.com
2026-06-08
LG Innotek is accelerating its push into advanced semiconductor packaging, announcing plans to expand its substrate manufacturing operations in Vietnam as it seeks to transform the business into a key growth engine and generate more than KRW3 trillion (approx. US$1.9 billion) in annual revenue by 2030.
2026-06-08
digitimes.com
2026-06-08
Andhra Pradesh is positioning itself as a semiconductor packaging hub, focusing on an entry point into the chip supply chain while wafer fabrication remains a long-term goal. Officials said packaging activities are already underway, as Indian states used Computex in Taipei to attract Taiwanese electronics and AI supply chain investment.
2026-05-31
www.thelec.net
2026-05-31
thelec.net
Solder balls used in semiconductor packaging. (Photo: THE ELEC)
South Korean prosecutors have launched a forced investigation after uncovering allegations that semiconductor packaging material suppliers colluded on pricing and supply volumes.
The Criminal Proceeds Recovery Division of the Seoul Central District Prosecutors' Office, headed by Chief Prosecutor So Jung-soo, began search and seizure
2026-05-30
digitimes.com
2026-05-30
Innolux plans to accelerate its transformation in 2026, with chairman and CEO Jim Hung pointing to three priorities: advanced semiconductor packaging, smart cockpits, and higher-margin panel applications.