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Nexperia and Semikron Danfoss Explore Strategic Collaboration on SiC Power Modules for Automotive Applications By Electronics Media - June 9, 2026 Share on Facebook Tweet on Twitter tweet SiC Power Modules – Nexperia B.V. and Semikron Danfoss GmbH have signed a Memorandum of Understanding (MoU) to explore a strategic collaboration on silicon carbide (SiC)-based power modules for automotive trac

Combining SiC chip expertise with module packaging could unlock EV drivetrain gains neither company achieves independently June 9, 2026 Nexperia and Semikron Danfoss have signed a memorandum of understanding to explore a joint approach to silicon carbide (SiC)-based power modules for automotive traction inverter applications. The collaboration would combine Nexperia’s SiC semiconductor expertise

This is a paid press release. Contact the press release distributor directly with any enquiries. Mitsubishi Electric and Semikron Danfoss Jointly Develop New Standard Package for Power Semiconductor Modules Business Wire Mon, 8 June 2026 at 6:00 am GMT-4 1 min read 6503.T -5.75% New LV100-type standard package with integrated 3-level circuit contributes to standardized inverter designs TOKYO, Ju