Semiconductor News & Analysis Feed
4168 articles
2026-06-16
www.mykxlg.com
2026-06-16
mykxlg.com
__fail__
2026-06-16
news.google.com
2026-06-16
Business Wire
2026-06-16
sg.finance.yahoo.com
2026-06-16
Yahoo Finance Singapore
This is a paid press release. Contact the press release distributor directly with any enquiries.
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools
Business Wire
Mon, 15 June 2026 at 7:00 pm GMT-7 3 min read
SNPS
-1.32%
6981.T
+0.43%
[Murata Manufacturing Co., Ltd.] New collaboration with Synopsys
KYOTO, Japan, June 16, 2026--(B
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
ASE Tech, TW0003711008
New high-density fan-out module, ASE Technology pushes advanced packaging for AI chips
16.06.2026 - 03:43:12 | ad-hoc-news.de
ASE Technology is highlighting its FOCoS fan-out module as a high-density packaging option for AI and data center processors, combining multiple dies and high-bandwidth memory in a single advanced substrate stack for hyperscale and HPC customers.
AS
2026-06-16
www.moomoo.com
2026-06-16
Moomoo
__fail__
2026-06-16
www.marketscreener.com
2026-06-16
marketscreener.com
Access Denied
You don't have permission to access "http://www.marketscreener.com/news/murata-manufacturing-collaborates-with-synopsys-to-provide-simulation-models-through-ansys-electro-ce7f5cded08af127" on this server.
Reference #18.46643717.1781655718.a41ec38
https://errors.edgesuite.net/18.46643717.1781655718.a41ec38
2026-06-16
www.prnewswire.com
2026-06-16
PR Newswire
Rapidus Signs MoU with Fondazione Chips-IT in Italy for Future Semiconductor Manufacturing
NEWS PROVIDED BY
Rapidus Corporation
Jun 15, 2026, 21:00 ET
SHARE THIS ARTICLE
New collaboration provides framework between the Japan government and Italy
TOKYO, June 15, 2026 /PRNewswire/ -- Rapidus Corporation today announced that it signed a Memorandum of Understanding (MoU) with the Fondazione
2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
This is a paid press release. Contact the press release distributor directly with any inquiries.
Rapidus Signs MoU with Fondazione Chips-IT in Italy for Future Semiconductor Manufacturing
PR Newswire
Mon, June 15, 2026 at 6:00 PM PDT 3 min read
New collaboration provides framework between the Japan government and Italy
TOKYO, June 15, 2026 /PRNewswire/ -- Rapidus Corporation today announced that
2026-06-16
digitimes.com
2026-06-16
Apple is stepping up the AI capabilities of its Siri voice assistant, and analysts say memory chip demand will rise along with it, potentially benefiting Apple's suppliers such as Samsung Electronics and SK Hynix. The shift could drive both shipment growth and higher prices for mobile DRAM.
2026-06-16
digitimes.com
2026-06-16
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS toward CoPoS as it builds out a fuller ecosystem ahead of rivals.
2026-06-16
digitimes.com
2026-06-16
ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor manufacturing. At the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, the partners unveiled a 300mm wafer integration flow that produced both n-type and p-type 2D-material transistors at a 50nm contacted poly
2026-06-16
digitimes.com
2026-06-16
Samsung Electronics' foundry business is reportedly expanding its strategic relationship with companies led by Elon Musk, with cooperation now spanning electric vehicles and emerging neurotechnology, according to Hankyungreporting.
2026-06-16
digitimes.com
2026-06-16
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market. According to Newsis, industry sources reported that SK Hynix had recently made positive progress in HBM4E development and was preparing to send samples soon, with shipments possibly beginning in June 2026 and no later th
2026-06-16
digitimes.com
2026-06-16
AMD said it will acquire MEXT, a move aimed at strengthening its AI and data center portfolio amid rising global memory demand. The deal is intended to help customers improve performance, reduce infrastructure costs, and accelerate the deployment of AI, analytics, and high-performance workloads across cloud and enterprise systems.
2026-06-16
digitimes.com
2026-06-16
Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025 to support Britain's semiconductor ecosystem, marking a step toward cooperation on future semiconductor manufacturing and potential customer development in the UK, according to Rapidus and reports from Nikkei, Bloomberg,and Reuters.
2026-06-16
digitimes.com
2026-06-16
The semiconductor supply chain is facing another raw material shock — this time from tungsten hexafluoride, or WF6, a specialty gas used in chip manufacturing. Planned production adjustments or exits by some Japanese suppliers in the second half of 2026 have intensified concerns over tighter global supply, sending prices sharply higher and raising the risk of disruption into 2027.
2026-06-16
digitimes.com
2026-06-16
Austria's AT&S plans to invest up to EUR2 billion (approx. US$2.32 billion) to expand its Kulim plant and a previously unused building at the second site in Kulim, Malaysia, as part of a broader push to capitalize on AI demand. The company said the investments will be fully supported and financed by long-term customer commitments, and it expects to represent at least five leading US tech partners.
2026-06-16
eetimes.com
2026-06-16
Pablo Valerio
Researchers at the University of São Paulo use RISC-V to build the Internet of Trees, a real-time monitoring network for the Amazon rainforest.
2026-06-16
digitimes.com
2026-06-16
China has recently eased controls on some indium phosphide (InP) substrates, relieving a bottleneck in optical communications capacity for the second half of the year. But supply chain players say the long-term priority is still to expand substrate capacity from non-China sources, with supply security for the AI industry outweighing price.
2026-06-16
digitimes.com
2026-06-16
Samsung Electronics has secured key technology for a 5nm-class magnetoresistive random-access memory cell, according to Korean financial daily Sedaily, moving ahead just four months after presenting what it described as the world's first 8nm-class MRAM at an international conference.