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2026-06-16
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2026-06-16
drrobertcastellano.substack.com
2026-06-16
Dr. Robert Castellano's Semiconductor Deep Dive Newsletter
AI Is No Longer Limited by Transistors. It Is Becoming Limited by Package Area
DR. ROBERT CASTELLANO
JUN 16, 2026
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What’s In This Article
The Next AI Bottleneck Has Arrived
Chart 1. CoWoS and CoPoS Cost Crossover
Why CoWoS Is Reaching Its Limits
Table 1. Evolution of TSMC Advanced Packaging Technologies
CoPoS Expands Package Area by More Than 5x
Table 2. CoWoS Versus CoPoS
Panel-Leve
2026-06-16
www.uidaho.edu
2026-06-16
University of Idaho
BY CHRIS COOK, U OF I EXECUTIVE DIRECTOR OF ADMISSIONS AND RECRUITMENT & FENG LI, MICRON ENDOWED PROFESSOR IN MICROELECTRONICS AND NGEM DIRECTOR
Semiconductors are no longer a niche corner of the tech economy. They are essential infrastructure. Microchips made from semiconductor materials power artificial intelligence, national defense systems, advanced manufacturing, transportation networks, ene
2026-06-16
www.thefastmode.com
2026-06-16
The Fast Mode
QumulusAl, a vertically integrated AI cloud infrastructure company, announced it has secured more than $124 million in customer subscriptions for 3-year terms with Hyperbolic and another leading AI inference platform.
These agreements support deployments totaling 1,280 NVIDIA Blackwell GPUs and include nearly $21.9 million in combined upfront customer commitments.
The customers operate some of t
2026-06-16
www.morningstar.com
2026-06-16
Morningstar
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Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools
Provided by Business Wire Jun 16, 2026, 10:00:00 AM
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Elect
2026-06-16
news.google.com
2026-06-16
EE Times Asia
2026-06-16
news.google.com
2026-06-16
EE Times Asia
2026-06-16
www.bastillepost.com
2026-06-16
bastillepost.com
KYOTO, Japan--(BUSINESS WIRE)--Jun 15, 2026--
Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) announces a new collaboration with Synopsys, Inc., enabling users of Synopsys' simulation tools to navigate directly to Murata's website to access and download the latest high-performance simulation models from Murata. The collaboration covers Synopsys' 3D electromagnetic field analysis
2026-06-16
www.joplinglobe.com
2026-06-16
The Joplin Globe
Generally cloudy. High 84F. Winds SW at 5 to 10 mph..
[Murata Manufacturing Co., Ltd.] New collaboration with Synopsys
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2026-06-16
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2026-06-16
Bluefield Daily Telegraph
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2026-06-16
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2026-06-16
Caledonian Record
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Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic
2026-06-16
www.ncnewsonline.com
2026-06-16
New Castle News
KYOTO, Japan--(BUSINESS WIRE)--Jun 15, 2026--
Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) announces a new collaboration with Synopsys, Inc., enabling users of Synopsys' simulation tools to navigate directly to Murata's website to access and download the latest high-performance simulation models from Murata. The collaboration covers Synopsys' 3D electromagnetic field analysis
2026-06-16
sg.finance.yahoo.com
2026-06-16
Yahoo Finance Singapore
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Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools
Business Wire
Mon, 15 June 2026 at 7:00 pm GMT-7 3 min read
SNPS
-1.32%
6981.T
+0.43%
[Murata Manufacturing Co., Ltd.] New collaboration with Synopsys
KYOTO, Japan, June 16, 2026--(B
2026-06-16
via.tt.se
2026-06-16
Via TT
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools
16.6.2026 04:00:00 CEST | Business Wire | Press Release
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Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) announces a new collaboration with Synopsys, Inc., enabling users of Synopsys' simulation tools to navigate directly to Murata's website to access an
2026-06-16
news.google.com
2026-06-16
Business Wire
2026-06-16
www.mykxlg.com
2026-06-16
mykxlg.com
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2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
ASE Tech, TW0003711008
New high-density fan-out module, ASE Technology pushes advanced packaging for AI chips
16.06.2026 - 03:43:12 | ad-hoc-news.de
ASE Technology is highlighting its FOCoS fan-out module as a high-density packaging option for AI and data center processors, combining multiple dies and high-bandwidth memory in a single advanced substrate stack for hyperscale and HPC customers.
AS
2026-06-16
www.moomoo.com
2026-06-16
Moomoo
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2026-06-16
www.marketscreener.com
2026-06-16
marketscreener.com
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2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
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Rapidus Signs MoU with Fondazione Chips-IT in Italy for Future Semiconductor Manufacturing
PR Newswire
Mon, June 15, 2026 at 6:00 PM PDT 3 min read
New collaboration provides framework between the Japan government and Italy
TOKYO, June 15, 2026 /PRNewswire/ -- Rapidus Corporation today announced that