Semiconductor News & Analysis Feed

351 articles
2026-05-27
www.alternativeswatch.com 2026-05-27 Alternatives Watch
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2026-05-27
sammyguru.com 2026-05-27 SammyGuru
Samsung may launch a Physical AI chiplet platform next year in collaboration with Cadence. The platform could support applications like robotics, autonomous driving, and industrial automation. It is being developed using the Korean foundry’s SF5A (5nm) process technology. In January 2026, Samsung and Cadence announced a partnership to develop a chiplet-based Physical AI semiconductor platform. Un
2026-05-27
www.trendforce.com 2026-05-27 TrendForce
[News] TSMC Reportedly Eyes Up to 15% 3nm Price Hike in 2H26, Further 5%–10% Seen in 2027 Amid AI, ASIC Demand 2026-05-27 Semiconductors editor News Please note that this article cites information from Commercial Times, Liberty Times, and UDN News. AI continues to drive tightness in advanced process capacity at TSMC. According to Commercial Times, citing sources, TSMC is expected to rais
2026-05-27
www.newelectronics.co.uk 2026-05-27 New Electronics
Share LinkedIn Teams WhatsApp Facebook Email X Neil Tyler 27 May 2026 More in Power RECOMMENDED ROHM unveils 5th-generation SiC MOSFETs with improved high-temperature efficiency Microchip increases hydrogen maser production with new Alabama facility Microchip compact crystal oscillator intended for high-stability timing applications Microchip unveils 3.3 kV SiC power modules for high-voltag
2026-05-27
www.digitimes.com 2026-05-27 digitimes
The agreement between Qualcomm and ByteDance positions the former for large-scale AI ASIC demand from the latter, as reported by Bloomberg, but market viability remains uncertain amid intense AI chip competition, evolving China procurement... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the sit
2026-05-27
www.bisinfotech.com 2026-05-27 Bisinfotech
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2026-05-27
www.eqs-news.com 2026-05-27 EQS News
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2026-05-27
www.prnewswire.com 2026-05-27 PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 Deutschland - English VOM NACHRICHTENDIENST USI 27 Mai, 2026, 05:00 GMT ARTIKEL TEILEN ~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor pa
2026-05-27
www.moomoo.com 2026-05-27 Moomoo
To create a seamless experience and for website quality and improvement purposes, we use cookie technologies for verification and quality purposes, to personalize the content presented, and to provide advertising that may be of specific interest to you. Learn our Privacy Policy here. May 27th - The industry of $Power semiconductor (LIST24211.HK)$ is trending higher today with 8 constituents up an
2026-05-27
www.thailand-business-news.com 2026-05-27 Thailand Business News
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2026-05-27
digitimes.com 2026-05-27
The world's largest chip designers are steadily growing more bullish on the future of cloud artificial intelligence (AI) chips known as ASICs (application-specific integrated circuits) — a market increasingly seen as the next major battleground in the global AI boom.
2026-05-27
digitimes.com 2026-05-27
The agreement between Qualcomm and ByteDance positions the former for large-scale AI ASIC demand from the latter, as reported by Bloomberg, but market viability remains uncertain amid intense AI chip competition, evolving China procurement preferences, and regulatory pressures affecting cross-border semiconductor adoption.
2026-05-27
www.manilatimes.net 2026-05-27 The Manila Times
~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.prnewswire.com 2026-05-27 PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 APAC - English NEWS PROVIDED BY USI 27 May, 2026, 07:00 CST SHARE THIS ARTICLE ~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging
2026-05-27
us.acrofan.com 2026-05-27 acrofan.com
~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.manilatimes.net 2026-05-27 The Manila Times
Visit ROHM at booth 318 in hall 9 Demonstrating cutting edge power semiconductor technologies. Get the latest news delivered to your inbox Sign up for The Manila Times newsletters By signing up with an email address, I acknowledge that I have read and agree to the Terms of Service and Privacy Policy. ADVERTISEMENT Santa Clara, CA and Willich/Nuremberg, Germany, May 26, 2026 (GLOBE NEWSWIRE) --
2026-05-27
www.taiwannews.com.tw 2026-05-27 Taiwan News
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2026-05-27
ca.finance.yahoo.com 2026-05-27 Yahoo! Finance Canada
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2026-05-26
ir.microchip.com 2026-05-26 Microchip Technology
Microchip Launches 3.3 kV HV‑D3 mSiC® Power Modules to Enable Solid-State Transformers for AI Data Centers May 26, 2026 8:00 am EDT Download as PDF New silicon carbide modules deliver the required thermal performance and efficiency for SSTs to increase power available for token generation CHANDLER, Ariz., May 26, 2026 (GLOBE NEWSWIRE) -- Microchip Technology (Nasdaq: MCHP) today announces the ava
2026-05-26
www.bisinfotech.com 2026-05-26 Bisinfotech
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