Semiconductor News & Analysis Feed

Intel has revealed a new high-bandwidth memory (HBM) architecture, called Cross-Batch Memory (XBM), in a patent filed in December 2024 and published in July 2026. XBM aims to overcome the high packaging costs and complexity associated with current interposer-based HBM by shifting DRAM cell fabricati

Intel has unveiled a new high-bandwidth memory (HBM) architecture through a patent filed in December 2024, aiming to address the packaging and cost bottlenecks associated with current interposer-based HBM solutions. The proposed Cross-Batch Memory (XBM) architecture shifts DRAM cells from the front-

Belgian research hub imec has made significant progress in chip integration technology, extending its 300mm RF silicon interposer platform to enable system-level integration of III-V chiplets with Si-CMOS technology. This advancement addresses emerging mmWave and sub-THz wireless applications, as we