Semiconductor News & Analysis Feed

JEDEC has approved the SPHBM4 standard, a new specification designed to address the high cost and complex packaging challenges associated with current HBM technologies. By enabling HBM4-level performance using standard packaging and fewer signal pins, SPHBM4 significantly reduces reliance on expensi

On June 8, 2026, Mitsubishi Electric and Semikron Danfoss announced the joint development of a new standard package for power semiconductor modules integrating 3-level circuits, aimed at improving efficiency in industrial drive equipment and renewable energy systems. Based on Mitsubishi's LV100 pack