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2026-05-27
LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC - Morningstar
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www.morningstar.com 2026-05-27 Morningstar
Home News PR Newswire LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC Provided by PR Newswire May 27, 2026, 8:00:00 PM LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at
Semiconductor SubstrateFC-BGARF-SiPCu-Post TechnologyAI Chips5G CommunicationChip PackagingSemiconductor Conference
2026-05-26
Intel's Rio Rancho fab becomes test case for AI-era chip packaging
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digitimes.com 2026-05-26
Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions Rio Rancho — its New Mexico site — as a global hub for next-generation packaging production.
2026-05-21
Huaxi Securities: AI development is driving significant growth in SiC demand, with SiC substrate and equipment companies expected to benefit substantially. - Moomoo
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www.moomoo.com 2026-05-21 Moomoo
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2026-05-21
Huaxi Securities: AI development is driving significant growth in SiC demand, with SiC substrate and equipment companies expected to benefit substantially. - 富途牛牛
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news.futunn.com 2026-05-21 富途牛牛
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2026-05-20
[News] Intel Says EMIB Customers Back Substrate Prepayments; 4 Taiwan, 2 Japan Suppliers Seek Commitments - TrendForce
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www.trendforce.com 2026-05-20 TrendForce
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2026-05-14
Samsung reportedly speeds up 3D NAND, packaging, and substrate plans - digitimes
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www.digitimes.com 2026-05-14 digitimes
Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates — areas it set aside after more than a year of prioritizing DRAM design and...The article requires paid subscription.Subscribe Now
Samsung Electronics3D NANDAdvanced PackagingSemiconductor ManufacturingFlash MemoryCompound SemiconductorsSubstrate TechnologyDRAM Design