Semiconductor News & Analysis Feed

NVIDIA and Australia’s AI facilitator Firmus Technologies will jointly provide global AI-native, enterprise, and ISV customers access to NVIDIA’s AI accelerated computing stack, with the infrastructure to be deployed at Firmus’ Batam campus in Indonesia. In a statement on Monday, Firmus said it has reached a partnership with NVIDIA for the move. The Australian firm expects to receive between $25

Gobi Partners has invested in GreatAsic through multiple funds, including Gobi Dana Impak Ventures, a fund backed by Khazanah Nasional Berhad through Dana Impak, as part of GreatAsic‘s recently closed $6.9 million Pre-Series A round led by Vertex Ventures Southeast Asia and India. In a statement of Monday, Malaysia-based venture capital firm Gobi Partners said the investment supports Dana Impak’s

Kenanga Research said Monday that advanced packaging will become the next battleground in semiconductor value chain and benefit Malaysia’s technology players. The research house said in a note that advanced packaging has emerged as a critical enabler of next-generation semiconductor performance, particularly as Moore’s Law slows and artificial intelligence (AI)/ high performance computing (HPC) w

Malaysia-based fabless custom chip design company GreatAsic has raised $6.9 million in a Pre-Series A round led by Vertex Ventures Southeast Asia & India, with participation from Ehsan Kapital and Gobi Partners. In a statement on Tuesday, Vertex Ventures said the investment is in line with Malaysia developing front-end chip design capabilities beyond its traditional role in semiconductor assembly

Silicon Box, a Singapore-based advanced semiconductor panel-level packaging and chiplet integration firm, has on Monday announced that it has secured S$100 million ($77.65 million) in debt financing from leading institutional investors – funds managed by Ares Management Corporation (Ares), InnoVen Capital, January Capital Growth Credit (January Capital), and Abound Capital. The facility includes

SK hynix unveils ‘iHBM’ thermal solution to boost AI performance MAY 26, 2026|BY LIUTENG Enhances heat dissipation by integrating ICEs into the HBM package Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility SEOUL

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