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ROHM's launch of the TSC3PAK SiC MOSFET package represents a significant advancement in power semiconductor technology, particularly for high-efficiency applications. The top-cooled design addresses critical thermal management challenges in power electronics, enabling better heat dissipation and imp

ROHM has introduced the TSC3PAK SiC MOSFET package in June 2026, aimed at enhancing efficiency and reliability in power conversion circuits for electric vehicles. The new package features a top-side heat dissipation structure that matches the thermal performance of conventional through-hole packages