Semiconductor News & Analysis Feed
1228 articles
2026-05-30
www.marketbeat.com
2026-05-30
MarketBeat
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2026-05-30
www.marketbeat.com
2026-05-30
MarketBeat
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2026-05-30
telecom.economictimes.indiatimes.com
2026-05-30
ET Telecom
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2026-05-30
www.gurufocus.com
2026-05-30
GuruFocus
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2026-05-30
digitimes.com
2026-05-30
Xintec, TSMC's packaging and testing unit, is preparing for a broader testing-led expansion that could affect global chip supply chains. The company said capacity gains, new equipment spending, and strategic-partner orders may support growth in 2026, even as it continues a gradual shift in its product mix and packaging portfolio.
2026-05-30
www.marketbeat.com
2026-05-30
MarketBeat
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2026-05-30
simplywall.st
2026-05-30
simplywall.st
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2026-05-30
finance.yahoo.com
2026-05-30
Yahoo Finance
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2026-05-30
wtvbam.com
2026-05-30
WTVB
By Wen-Yee Lee
TAIPEI, May 29 (Reuters) – Taiwan chip designer MediaTek said on Friday it supports both TSMC’s and Intel’s advanced packaging technologies, allowing customers to choose between the two approaches.
“We’re one of the few custom silicon providers that support both (TSMC’s) CoWoS and (Intel’s) EMIB. We let our customers choose,” MediaTek Senior Vice President Vince Hu told reporter
2026-05-30
www.foreignpolicyjournal.com
2026-05-30
foreignpolicyjournal.com
Analysts at Bernstein SocGen Group reiterated an Outperform rating on Taiwan Semiconductor Manufacturing Company (NYSE: TSM) on May 18, raising the price target to $430 from $351.
The revised price target reflects growing confidence that Taiwan Semiconductor is entering a phase of robust and sustained business expansion.
Government has made youth unemployment 'worse with every decision they've m
2026-05-30
www.taipeitimes.com
2026-05-30
Taipei Times
MediaTek Inc (聯發科) yesterday revealed that a data center client opted for Intel Corp’s advanced packaging technology to build an in-house customized artificial intelligence (AI) accelerator, marking the first adoption of the technology in MediaTek’s customized chip design portfolio.
Mediatek did not disclose the customer’s name, but analysts said the company is designing a tensor process unit — a
2026-05-29
247wallst.com
2026-05-29
24/7 Wall St.
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2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-29
www.datacenterdynamics.com
2026-05-29
Data Center Dynamics
TSMC customers are more focused on making their hardware energy efficient than any other metric of improvement, Kevin Zhang, deputy co-chief operations officer and SVP at TSMC, said during the company’s Technology Symposium in Amsterdam on May 28.
Speaking during a press briefing, Zhang said that across the board – from Edge to mobile, IoT, HPC, or in the data center – customers want “more energy
2026-05-29
cryptobriefing.com
2026-05-29
Crypto Briefing
MediaTek adopts Intel’s advanced chip packaging alongside TSMC’s services
The chipmaker is hedging its bets with a dual packaging strategy as AI demand strains TSMC's capacity.
2026-05-29
cryptobriefing.com
2026-05-29
Crypto Briefing
MediaTek adopts Intel’s advanced chip packaging alongside TSMC’s services
The chipmaker's dual-sourcing strategy for AI silicon reflects both soaring demand and real capacity bottlenecks at TSMC.
2026-05-29
247wallst.com
2026-05-29
24/7 Wall St.
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2026-05-29
wkzo.com
2026-05-29
WKZO
By Wen-Yee Lee
TAIPEI, May 29 (Reuters) – Taiwan chip designer MediaTek said on Friday it supports both TSMC’s and Intel’s advanced packaging technologies, allowing customers to choose between the two approaches.
“We’re one of the few custom silicon providers that support both (TSMC’s) CoWoS and (Intel’s) EMIB. We let our customers choose,” MediaTek Senior Vice President Vince Hu told reporter
2026-05-29
finimize.com
2026-05-29
Finimize
The chip designer says it supports both TSMC’s CoWoS and Intel’s EMIB as it targets $2 billion of 2026 data center revenue.
MediaTek, a Taiwanese chip designer best known for smartphone processors, says it can package custom AI data-center chips using either TSMC’s CoWoS or Intel’s EMIB, giving customers two routes to get to mass production.
“Advanced packaging” is the step that connects multipl
2026-05-29
www.marketbeat.com
2026-05-29
MarketBeat
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