Semiconductor News & Analysis Feed
87 articles
2026-05-29
digitimes.com
2026-05-29
Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply tighten worldwide. For readers across global tech markets, the shift means access to manufacturing capacity, not just chip design, is becoming the main determinant of who can supply the next wave of AI hardware.
2026-05-28
www.engineering.com
2026-05-28
Engineering.com
www.engineering.com
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2026-05-28
www.indexbox.io
2026-05-28
IndexBox
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2026-05-28
www.digitimes.com
2026-05-28
digitimes
Synopsys said the rise of agentic artificial intelligence and the integration of Ansys are creating new growth opportunities across electronic design automation (EDA) and simulation software, as semiconductor and industrial customers adopt more complex...
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2026-05-28
digitimes.com
2026-05-28
Synopsys said the rise of agentic artificial intelligence and the integration of Ansys are creating new growth opportunities across electronic design automation (EDA) and simulation software, as semiconductor and industrial customers adopt more complex AI-driven engineering workflows.
2026-05-28
digitimes.com
2026-05-28
During the 2026 Europe Day Dinner, Taiwanese President Ching-te Lai referenced how coal and steel formed the foundation of peace in Europe, comparing that to how semiconductors and AI shape global prosperity and democratic security for Taiwan. He said Taiwan's semiconductor ecosystem integrates critical technologies from leading European companies, praising the nature of like-minded partners worki
2026-05-28
digitimes.com
2026-05-28
Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence (AI) and high-performance computing supply chains by significantly improving chip integration speeds and manufacturing efficiency for AI data centers and cloud infrastructure providers.
2026-05-27
www.msn.com
2026-05-27
MSN
Shares of Synopsys fell Wednesday in after-hours trading even though the chip-design software and hardware firm reported better-than-expected results.
Adjusted earnings per share came in at $3.35 for the company’s fiscal second quarter ended in April, above analyst estimates of $3.15 per share.
Revenue, meanwhile, hit $2.28 billion. Wall Street analysts were expecting $2.25 billion.
Synopsys al
2026-05-27
www.barrons.com
2026-05-27
Barron's
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2026-05-27
digitimes.com
2026-05-27
The world's largest chip designers are steadily growing more bullish on the future of cloud artificial intelligence (AI) chips known as ASICs (application-specific integrated circuits) — a market increasingly seen as the next major battleground in the global AI boom.
2026-05-27
digitimes.com
2026-05-27
Transcend announced it will exhibit enterprise solid-state drives, DDR5 7200 memory, and embedded camera modules at COMPUTEX 2026 in the Storage and Management Solutions area, saying the showcase will demonstrate integrated capabilities in AI computing storage, high-speed transmission, and reliable data processing. The firm highlighted that as AI expands to endpoint applications, performance and s
2026-05-27
www.upi.com
2026-05-27
upi.com
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2026-05-26
www.tomshardware.com
2026-05-26
Tom's Hardware
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2026-05-26
www.blocksandfiles.com
2026-05-26
Blocks & Files
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2026-05-26
cryptobriefing.com
2026-05-26
Crypto Briefing
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2026-05-26
vir.com.vn
2026-05-26
Vietnam Investment Review - VIR
SEOUL, South Korea, May 26, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products.
[1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-b
2026-05-26
www.businesskorea.co.kr
2026-05-26
Businesskorea
The Company Says iHBM Cuts Thermal Resistance By Over 30%
SK Hynix unveiled its ‘iHBM’ technology on May 26, which significantly reduces heat generation by integrating a unified cooling element within the HBM package. (Photo source: SK Hynix)
SK Hynix has made a bold bet on solving the heat problem, which has emerged as the biggest challenge of the artificial intelligence (AI) semiconductor era
2026-05-26
digitimes.com
2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo
2026-05-26
digitimes.com
2026-05-26
ADATA Technology said it will present a cloud-to-edge artificial intelligence ecosystem at COMPUTEX 2026, bringing together its enterprise storage brand TRUSTA, ADATA Industrial, gaming brand XPG, and AIoT unit ATrack to showcase hardware and software integrations across data centers, PCs, and edge devices. The company announced partnerships and cross-domain integrations with Nvidia, Intel, Advant
2026-05-26
simplywall.st
2026-05-26
simplywall.st
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