Semiconductor News & Analysis Feed
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2026-06-16
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2026-06-16
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2026-06-16
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2026-06-16
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2026-06-16
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2026-06-16
digitimes
ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor manufacturing. At the 2026 IEEE/JSAP Symposium on VLSI Technology and...
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2026-06-16
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Taiwan Semiconductor Manufacturing Company Limited (TSM)’s CEO Expresses Concern About Water, Talent Shortages
Published on June 16, 2026 at 2:27 am by ASHAR JAWAD in News
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Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) is among the 10 Stocks ChatGPT Predicts Could Make You Wealthy in 3 Years. While speaking at a ceremony for a new science park in Pingtung, the company’s
2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
Taiwan Semiconductor Manufacturing Company Limited (TSM)’s CEO Expresses Concern About Water, Talent Shortages
Ashar Jawad
Mon, June 15, 2026 at 11:27 PM PDT 2 min read
2330.TW
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TSM
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Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) is among the 10 Stocks ChatGPT Predicts Could Make You Wealthy in 3 Years. While speaking at a ceremo
2026-06-16
www.marketscreener.com
2026-06-16
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2026-06-16
www.prnewswire.com
2026-06-16
PR Newswire
Rapidus Signs MoU with Fondazione Chips-IT in Italy for Future Semiconductor Manufacturing
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Rapidus Corporation
Jun 15, 2026, 21:00 ET
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New collaboration provides framework between the Japan government and Italy
TOKYO, June 15, 2026 /PRNewswire/ -- Rapidus Corporation today announced that it signed a Memorandum of Understanding (MoU) with the Fondazione
2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
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Rapidus Signs MoU with Fondazione Chips-IT in Italy for Future Semiconductor Manufacturing
PR Newswire
Mon, June 15, 2026 at 6:00 PM PDT 3 min read
New collaboration provides framework between the Japan government and Italy
TOKYO, June 15, 2026 /PRNewswire/ -- Rapidus Corporation today announced that
2026-06-16
digitimes.com
2026-06-16
Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025 to support Britain's semiconductor ecosystem, marking a step toward cooperation on future semiconductor manufacturing and potential customer development in the UK, according to Rapidus and reports from Nikkei, Bloomberg,and Reuters.
2026-06-16
digitimes.com
2026-06-16
Global expansion in AI chips, advanced logic processes, and multilayer 3D NAND flash memory is driving demand for tungsten hexafluoride (WF6), a critical electronic specialty gas used in semiconductor manufacturing. Limited short-term supply additions and low industry inventories are widening the supply-demand gap, triggering a rapid price increase.
2026-06-16
digitimes.com
2026-06-16
The semiconductor supply chain is facing another raw material shock — this time from tungsten hexafluoride, or WF6, a specialty gas used in chip manufacturing. Planned production adjustments or exits by some Japanese suppliers in the second half of 2026 have intensified concerns over tighter global supply, sending prices sharply higher and raising the risk of disruption into 2027.
2026-06-16
digitimes.com
2026-06-16
Researchers and chipmakers presented new logic, memory, and device architectures at the 2026 IEEE/JSAP VLSI Technology and Circuits Symposium in Honolulu, with several results pointing toward pilot production and mass manufacturing.
2026-06-16
digitimes.com
2026-06-16
Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced packaging capacity, according to the latest Worldwide Semiconductor Equipment Market Statistics report from SEMI.
2026-06-16
digitimes.com
2026-06-16
ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor manufacturing. At the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, the partners unveiled a 300mm wafer integration flow that produced both n-type and p-type 2D-material transistors at a 50nm contacted poly