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194 articles
Trending Companies
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Trending Technologies
EUV61 3nm47 AI22 GPU18 HBM14 DRAM13 AI chips12 chip design5 AI infrastructure5 SoC5 3D printing5 Semiconductor4 CUDA4 HBM44 HBM3E4
2026-07-08
Ho Chi Minh City proposes subsidy of up to $570,000 for domestic chip design projects - Tuoi Tre News | The News Gateway to Vietnam
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news.tuoitre.vn 2026-07-08 Tuoi Tre News | The News Gateway to Vietnam
2026-07-08
Advanced packaging is poised for a pivotal shift: Goldman Sachs is bullish on the leading glass substrate player, while Ming-Chi Kuo strongly backs Taiwan Semiconductor (TSM.US). - Moomoo
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www.moomoo.com 2026-07-08 Moomoo
2026-07-08
SK Hynix’s Offering Reportedly Oversubscribed Multiple Times Amid Prolonged Memory Stocks Sell-Off - Stocktwits
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stocktwits.com 2026-07-08 Stocktwits
2026-07-08
SK Hynix’s Offering Reportedly Oversubscribed Multiple Times Amid Prolonged Memory Stocks Sell-Off - Yahoo Finance
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finance.yahoo.com 2026-07-08 Yahoo Finance
2026-07-07
SK Hynix US Listing Said to Be Multiple Times Oversubscribed - Bloomberg.com
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www.bloomberg.com 2026-07-07 Bloomberg.com
2026-07-07
Silo Pharma Subsidiary QwikAgents Joins NVIDIA Developer Program to Advance AI Agent Platform - Quiver Quantitative
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news.google.com 2026-07-07 Quiver Quantitative
2026-07-07
UBS Told Clients to Sell SK Hynix in One Market and Buy in Another: What is Happening? - BeInCrypto
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beincrypto.com 2026-07-07 BeInCrypto
2026-07-07
Scrutinising 50 mm AlN substrates - Compound Semiconductor
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compoundsemiconductor.net 2026-07-07 Compound Semiconductor
2026-07-07
eSIM Evolves from Subscriber Identity to Device Trust
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eetimes.com 2026-07-07
eSIM turns SIMs into device trust anchors for IoT, cars and AI, letting fleets switch networks and stay secure remotely.
eSIMdevice trustsecurity foundationIoTmobile connectivitydigital identityremote provisioningindustrial IoT
2026-07-07
Buy SK Hynix’s New ADRs and Sell Seoul-Listed Shares, UBS Says - Bloomberg.com
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www.bloomberg.com 2026-07-07 Bloomberg.com
2026-07-07
UBS Remains Bullish on Texas Instruments (TXN) – Here’s Why - Insider Monkey
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news.google.com 2026-07-07 Insider Monkey
2026-07-07
UBS Remains Bullish on Texas Instruments (TXN) – Here’s Why - Yahoo Finance
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news.google.com 2026-07-07 Yahoo Finance
2026-07-06
Working prototype of open-source printer that promises user-repairability and no subscriptions appears in first video
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tomshardware.com 2026-07-06 Luke James
Open Tools, a Paris-based startup, has announced that its Open Printer has been nominated for two French Design Awards.
Open Source HardwarePrinterUser RepairabilityNo Subscription ModelRaspberry PiSTMicroelectronicsCreative CommonsCUPS
2026-07-06
SanDisk Rebounds 5%, Western Digital Gains 5%, Micron Climbs 3% as UBS, Citi, BofA Turn Bullish on Memory - Yahoo Finance
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news.google.com 2026-07-06 Yahoo Finance
2026-07-06
SanDisk Rebounds 5%, Western Digital Gains 5%, Micron Climbs 3% as UBS, Citi, BofA Turn Bullish on Memory - 24/7 Wall St.
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news.google.com 2026-07-06 24/7 Wall St.
2026-07-06
UBS Calls $340 Target, Sees Marvell's 3nm AI Chip and CXL Tech Unlocking a $10 Billion Market - finance.biggo.com
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news.google.com 2026-07-06 finance.biggo.com
2026-07-06
UBS reiterates Micron stock Buy rating on memory pricing strength - Investing.com
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news.google.com 2026-07-06 Investing.com
2026-07-06
Weekly Recap: Export‑curb risk to ASML China shipments and UBS sales outlook - TradingView
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news.google.com 2026-07-06 TradingView
2026-07-06
Greatek Electronics advances Taiwan+1 plan with acquisition of Onsemi Philippines packaging plant
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digitimes.com 2026-07-06
Greatek Electronics, a subsidiary of memory packaging and testing provider Powertech Technology (PTI), has approved the acquisition of On Semiconductor SSMP Philippines, a packaging and testing services company under the On Semiconductor (Onsemi) group, using internal funds. The acquisition aims to strengthen the group's overseas operational footprint and improve its global customer service capabi
2026-07-06
Samsung Electro-Mechanics, Sumitomo Chemical to form glass-core venture for chip substrates
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digitimes.com 2026-07-06
Samsung Electro-Mechanics signed a final agreement on July 2 with Sumitomo Chemical's Korean subsidiary Dongwoo Fine-Chem to form a joint venture that will produce glass cores, a key material used in next-generation semiconductor package substrates, the companies said.