Semiconductor News & Analysis Feed
199 articles
2026-06-16
digitimes.com
2026-06-16
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS toward CoPoS as it builds out a fuller ecosystem ahead of rivals.
2026-06-16
digitimes.com
2026-06-16
Austria's AT&S plans to invest up to EUR2 billion (approx. US$2.32 billion) to expand its Kulim plant and a previously unused building at the second site in Kulim, Malaysia, as part of a broader push to capitalize on AI demand. The company said the investments will be fully supported and financed by long-term customer commitments, and it expects to represent at least five leading US tech partners.
2026-06-16
digitimes.com
2026-06-16
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC substrate suppliers,Unimicron,Kinsus, andNanya PCB, to restart capacity expansion targeting GPU, CPU, and ASIC customers.
2026-06-15
www.digitimes.com
2026-06-15
digitimes
China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026 batch shipped at the end of May following an earlier release in 2025, easing a capacity bottleneck in the optical...
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2026-06-15
digitimes.com
2026-06-15
China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026 batch shipped at the end of May following an earlier release in 2025, easing a capacity bottleneck in the optical communications market. Taiwanese compound semiconductor suppliers including Visual Photonics Epitaxy (VPEC) and Global Communication Semiconductors (GCS)
2026-06-15
digitimes.com
2026-06-15
LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand for substrates used in AI servers, 5G smartphones, and on-device AI chips. The expansion targets RF-SiP, FC-CSP, and FC-BGA substrates, as substrate suppliers adjust capacity plans to stronger demand from advanced mobile devices and AI infrastructure.
2026-06-14
digitimes.com
2026-06-14
Chunghwa Leading Photonics Tech, a subsidiary of Chunghwa Telecom, is set to list on the Taipei Emerging Stock Board. The company has recorded record-high revenue and gross margin in the first four months of 2026, boosted by rising demand in Industry 5.0 applications, advanced semiconductor process inspection, and AI data center optical communication. With short-wave infrared (SWIR) transmissive a
2026-06-14
www.insidermonkey.com
2026-06-14
Insider Monkey
NEWS
Taiwan Semiconductor (TSM) Posts Strong May Sales, UBS Names Stock a Top Pick on Agentic AI Outlook
Published on June 13, 2026 at 1:59 pm by FAHEEM TAHIR in News
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With a profit margin of 47.34% and net income of $55.13 billion (FY25), Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) ranks among the most profitable blue chip stocks to buy according to hedge funds. Meanwhile,
2026-06-14
finance.yahoo.com
2026-06-14
Yahoo Finance
Taiwan Semiconductor (TSM) Posts Strong May Sales, UBS Names Stock a Top Pick on Agentic AI Outlook
Faheem Tahir
Sat, June 13, 2026 at 10:59 AM PDT 2 min read
2330.TW
+2.67%
DX-Y.NYB
+0.06%
TSM
+0.68%
Trade TSM on Coinbase
Trading disclosure
With a profit margin of 47.34% and net income of $55.13 billion (FY25), Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) ranks among the most pr
2026-06-13
tomshardware.com
2026-06-13
Jowi Morales
A $200 ChatGPT subscription could cost as much as $14,000 in API pricing.
2026-06-13
news.google.com
2026-06-13
digitimes
2026-06-13
digitimes.com
2026-06-13
During a panel discussion between executives and research experts from Bosch, Infineon, Rohm Semiconductor, Nexperia, Wolfspeed, and Omdia at PCIM Europe 2026, one reality was made clear: frictionless, globalized chip manufacturing is ending. While the conversation reflected industry enthusiasm for new applications such as AI servers and industrial motor drives, it was tempered by macroeconomic re
2026-06-13
news.google.com
2026-06-13
Stock Titan
2026-06-12
news.futunn.com
2026-06-12
富途牛牛
__fail__
2026-06-12
www.msn.com
2026-06-12
MSN
Infineon Technologies AG (IFNNY) is set to inaugurate its largest-ever standalone investment, a €5B ($5.8 billion) semiconductor manufacturing facility backed by European Union subsidies, as the bloc pushes to strengthen domestic chip production.
The power chip fab, which is an extension of the German company’s Dresden campus, will open on July 2, Chief Operating Officer Alexander Gorski said this
2026-06-12
digitimes.com
2026-06-12
Taiwan's semiconductor and electronics supply-chain companies continued to post generally firm sales in May, according to monthly revenue data and company disclosures, with the strongest accumulated growth concentrated in AI-linked logic, testing, substrate, and copper-clad laminate suppliers.
2026-06-11
digitimes.com
2026-06-11
As artificial intelligence (AI) fuels an unprecedented surge in demand for advanced semiconductors, Applied Materials is deepening its commitment to one of Asia's most important chipmaking hubs.
2026-06-11
digitimes.com
2026-06-11
Applied Materials is expanding manufacturing and research in Singapore as artificial intelligence (AI) drives a wider shift in semiconductor planning, supply chains, and investment. The move highlights how AI demand is influencing chipmakers, equipment suppliers, and global customers, with implications for production capacity, regional innovation hubs, and technology markets worldwide.
2026-06-11
digitimes.com
2026-06-11
AI infrastructure demand is lifting high-end PCB orders, but fresh bottlenecks are emerging in the upstream copper-clad laminate (CCL) supply chain. T-glass glass fiber cloth remains tight after disrupting the high-end ABF substrate market. HVLP4 copper foil is set to become the next constraint in the second half of 2026.
2026-06-10
www.mk.co.kr
2026-06-10
매일경제
사진 확대
"We’ll cover the investment costs, so please secure the substrate supply first."
Competition to secure supply chains in the artificial intelligence (AI) semiconductor market is entering a new phase. Just one or two years ago, High Bandwidth Memory (HBM) was the hardest component to obtain. Concerns then shifted to shortages of general-purpose DRAM and NAND flash memory, and now semiconducto