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HANOI, VIETNAM - Media OutReach Newswire – 9 June 2026 – VinRobotics, Vingroup's pioneering robotics company, today announced the signing of a Memorandum of Understanding (MoU) with Infineon Technologies AG, a global semiconductor leader in power systems and IoT, to explore collaboration opportunities in building next-generation robotics applications based on advanced semiconductor technology. The

As part of the collaboration, Infineon will supply silicon carbide power modules to Siemens for use in its Sentron 3QD2 semiconductor circuit breakers. This will enhance the efficiency, power density and reliability of Siemens' protection solution. Andreas Weisl, executive vice president and chief sales officer of Industrial and Infrastructure at Infineon, noted that AI data centres and factories

SEOUL, South Korea, May 26, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products. [1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-b