Semiconductor News & Analysis Feed
7353 articles
2026-06-12
www.digitimes.com
2026-06-12
digitimes
Cadence and Intel Foundry are expanding their collaboration on advanced chip design, a move that could affect future semiconductors used in devices and data centers worldwide. The agreement aims to improve performance, power efficiency, and design readiness...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time
2026-06-12
www.reuters.com
2026-06-12
Reuters
__fail__
2026-06-12
www.digitimes.com
2026-06-12
digitimes
ChangXin Memory Technologies (CXMT), China's largest DRAM maker, plans to raise approximately CNY29.5 billion (US$4.35 billion) through an IPO on Shanghai's STAR Market, fueling debate about whether China's push into memory semiconductors can eventually erode...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each tim
2026-06-12
content-technology.com
2026-06-12
Content + Technology
HomePost Production
POST PRODUCTION
1Legion RTX Pro 6000 Blackwell as Dedicated Infrastructure
By
Brad Watts
12/06/2026
8
FacebookTwitterPinterestWhatsApp
1Legion, a dedicated bare-metal GPU infrastructure provider, has announced the availability of the NVIDIA RTX Pro 6000 Blackwell as a full bare-metal server on its infrastructure platform.
The offering is purpose-built for media technology ven
2026-06-12
news.google.com
2026-06-12
The Korea Herald
2026-06-12
www.koreaherald.com
2026-06-12
The Korea Herald
SK hynix headquarters in Icheon, Gyeonggi Province (Yonhap)
SK hynix is reviewing the use of external generative artificial intelligence models, including ChatGPT, inside the company, as Korea’s major chipmakers move to bring AI deeper into day-to-day work.
The move comes as companies are looking beyond AI as a simple productivity tool and seeking to use it more broadly in research and developme
2026-06-12
news.google.com
2026-06-12
HealthExec
2026-06-12
digitimes.com
2026-06-12
Breaking the inference barrier requires a rethink of the whole system architecture, not just faster compute. This was the key takeaway from a recent panel discussion at SuperAI Singapore, which brought chip makers and an AI model accelerator together to address how to overcome inference bottlenecks at a time when compute workloads are hitting up against physical limits.
2026-06-12
digitimes.com
2026-06-12
Chinese PC major Lenovo is reportedly set to raise prices across its entire product line from July 2026, with increases broadly in line with its first round of adjustments in March. Retail prices for some models could rise by as much as CNY1,000 (approx. US$148).
2026-06-12
digitimes.com
2026-06-12
China's two leading memory chipmakers, CXMT and YMTC, are moving closer to the capital market, putting the country's memory industry back under the semiconductor spotlight.
2026-06-12
digitimes.com
2026-06-12
ChangXin Memory Technologies (CXMT), China's largest DRAM maker, plans to raise approximately CNY29.5 billion (US$4.35 billion) through an IPO on Shanghai's STAR Market, fueling debate about whether China's push into memory semiconductors can eventually erode the dominance of the industry's established players.
2026-06-12
digitimes.com
2026-06-12
As CXMT and YMTC move toward initial public offerings, other players across China's memory supply chain are also advancing expansion, fundraising, and listing plans. The activity spans memory modules, controller chips, and niche DRAM, underscoring how China's memory industry is evolving from upstream chipmakers into a broader supply chain ecosystem.
2026-06-12
digitimes.com
2026-06-12
Hanmi Semiconductor plans to invest KRW50 billion (US$32.81 million) in SpaceX, highlighting how space, satellites, and artificial intelligence infrastructure are increasingly linked. For global readers, the deal signals how semiconductor suppliers are positioning themselves around next-generation supply chains, customer demand, and the expansion of AI-driven industrial ecosystems.
2026-06-12
digitimes.com
2026-06-12
MediaTek reported May 2026 revenue of NT$47.43 billion (approx. US$1.5 billion), up 1.49% from the previous month and 4.99% from a year earlier. Cumulative revenue for the first five months of 2026 totaled NT$243.32 billion, down 1.59% from the same period last year.
2026-06-12
digitimes.com
2026-06-12
Cadence and Intel Foundry are expanding their collaboration on advanced chip design, a move that could affect future semiconductors used in devices and data centers worldwide. The agreement aims to improve performance, power efficiency, and design readiness as chipmakers race to bring next-generation technologies to market.
2026-06-12
digitimes.com
2026-06-12
SK Hynix is preparing to begin mass production of its next-generation 375-layer 3D NAND flash memory by year-end, while pushing ahead with a broader capacity buildout and moving toward a US listing as early as August.
2026-06-12
digitimes.com
2026-06-12
The artificial intelligence (AI) industry is expanding at a pace that the physical world cannot match, and the gap between digital demand and real-world supply is widening across every layer of the infrastructure stack, from power generation to chip manufacturing to data center construction. That was the assessment of Sachin Hindupur, global strategy and operations leader at AMD, in a presentation
2026-06-12
digitimes.com
2026-06-12
United Nova Technology (UNT) is expanding from automotive and industrial chips into AI server power management and optical interconnects through a CNY20 billion (US$3 billion) 12-inch mixed-signal fab project.
2026-06-12
digitimes.com
2026-06-12
India's official think tank NITI Aayog has outlined a 2035 roadmap for India to become a more central part of the global semiconductor industry, warning that continued reliance on imports leaves the country exposed to cost, supply, and security risks.
2026-06-12
digitimes.com
2026-06-12
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these high-frequency, high-efficiency chips, the industry is driving an architectural shift: shrinking inverter volumes, eliminating heavy copper basepl