Semiconductor News & Analysis Feed
7506 articles
2026-05-27
tomshardware.com
2026-05-27
Bruno Ferreira
Microsoft's GitHub bans security researcher who posted zero-day Windows exploits
2026-05-27
www.alternativeswatch.com
2026-05-27
Alternatives Watch
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2026-05-27
phemex.com
2026-05-27
Phemex
Quick Answer: Micron Technology (NASDAQ: MU) is the breakout semiconductor story of 2026, surging 19.29% on May 26 to close at $895.88 and briefly topping a $1 trillion market cap for the first time. The rally was triggered by a UBS price target hike to $1,625 — nearly tripling its prior target — on the back of fully sold-out HBM AI memory production, a record Q2 2026 of $23.86B in revenue (+196.2
2026-05-27
simplywall.st
2026-05-27
simplywall.st
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2026-05-27
www.reuters.com
2026-05-27
Reuters
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2026-05-27
www.siliconrepublic.com
2026-05-27
Silicon Republic
BUSINESS
Micron, SK Hynix hit $1trn valuation amid AI chip demand
27 MAY 2026
SAVE ARTICLE
Image: © MakZin/Stock.adobe.com
Micron and SK Hynix join rival chipmaker Samsung in the $1trn club, after the latter hit the milestone valuation at the start of the month.
Leading chipmakers Micron and SK Hynix have both surpassed $1trn in market value, as AI drives demand for the companies’ memory
2026-05-27
sammyguru.com
2026-05-27
SammyGuru
Samsung may launch a Physical AI chiplet platform next year in collaboration with Cadence. The platform could support applications like robotics, autonomous driving, and industrial automation. It is being developed using the Korean foundry’s SF5A (5nm) process technology.
In January 2026, Samsung and Cadence announced a partnership to develop a chiplet-based Physical AI semiconductor platform. Un
2026-05-27
www.marketwatch.com
2026-05-27
MarketWatch
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2026-05-27
www.marketscreener.com
2026-05-27
marketscreener.com
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2026-05-27
en.sedaily.com
2026-05-27
Seoul Economic Daily
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2026-05-27
www.marketbeat.com
2026-05-27
MarketBeat
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2026-05-27
www.communicationstoday.co.in
2026-05-27
Communications Today
COMPANY NEWS
SK hynix unveils ‘iHBM’ technology to reduce HBM heat
May 27, 2026
SK hynix on May 26 unveiled a new thermal management technology called “iHBM,” designed to address heat generation issues in high-bandwidth memory (HBM) products operating at increasingly higher speeds.
The key feature of iHBM is an integrated thermal control component called ICE, embedded directly inside the HBM pac
2026-05-27
en.cryptonomist.ch
2026-05-27
The Cryptonomist
HomeZ - Banner home engSK Hynix trillion valuation jumps after 12% record rally on HBM
Z - Banner home eng
SK Hynix trillion valuation jumps after 12% record rally on HBM
27 May 2026
Share
SK Hynix trillion valuation lifts $1T memory-chip race on HBM
SK Hynix trillion valuation became one of Wednesday’s biggest market stories after the South Korean memory-chip giant surged past the $1 trillion m
2026-05-27
www.marketbeat.com
2026-05-27
MarketBeat
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2026-05-27
www.kedglobal.com
2026-05-27
KED Global
Samsung, SK Hynix jump as Korea’s first single-stock leverage ETFs debut
Samsung Electronics Co. and SK Hynix Inc. rallied on Wednesday as South Korea’s first leverage and inverse exchange-traded funds tracking individual stocks made their market debut, giving investors a new way to amplify bets on the country’s two dominant memory chip makers.Samsung E
2026-05-27
www.bloomberg.com
2026-05-27
Bloomberg.com
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2026-05-27
www.bloomberg.com
2026-05-27
Bloomberg.com
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2026-05-27
www.msn.com
2026-05-27
MSN
Memory-chip makers SK Hynix and Micron Technology have joined an elite group of companies with market values exceeding $1 trillion amid the artificial-intelligence-driven chip boom.
Shares of the world’s second-largest memory-chip maker SK Hynix have more than tripled this year. On Wednesday, they closed 9.3% higher, bringing the South Korean firm’s market capitalization to 1.599 quadrillion won,
2026-05-27
www.zacks.com
2026-05-27
Zacks Investment Research
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2026-05-27
www.indexbox.io
2026-05-27
IndexBox
Thermal management has become the primary limiting factor in high-performance computing and AI accelerator packaging. Contemporary packages combine high-power ASICs with multiple High Bandwidth Memory stacks on a silicon interposer, resulting in closely linked thermal and mechanical interactions. Thermal crosstalk between dies increases HBM junction temperatures, while mismatched coefficients of t