Semiconductor News & Analysis Feed
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2026-07-06
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2026-07-06
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2026-07-06
digitimes.com
2026-07-06
Dutch semiconductor equipment startup Nearfield Instruments has completed a US$380 million Series D funding round, the largest-ever fundraising for a Dutch deep-tech company. The company is now targeting an initial public offering (IPO) in 2028.
2026-07-06
digitimes.com
2026-07-06
Meta is reportedly exploring a new AI cloud infrastructure business that would let enterprises use its AI models and some unused GPU capacity, a move that could lift hardware utilization and create a new revenue stream from its heavy artificial intelligence spending. The proposal has revived talk of an AI bubble, but key industry barometers Nvidia and TSMC still show no sign of a broad demand slow
2026-07-06
digitimes.com
2026-07-06
As physical AI and robotics spread globally, NXP CEO Rafael Sotomayor said robots will only reach commercial scale if they can think and act independently. For international industries, that shift could determine whether factory automation, humanoids, and smart machines become practical tools or remain costly demonstrations.
2026-07-06
digitimes.com
2026-07-06
The global high-bandwidth memory market is expected to pivot from HBM3E to HBM4 in the second half of 2026, setting up a sharper contest for market share among Samsung Electronics, SK Hynix, and Micron Technology.
2026-07-06
digitimes.com
2026-07-06
Atomic Semi, the semiconductor equipment startup founded by chip architect Jim Keller, has rebranded as Fab2 and moved its headquarters to Austin, Texas, with a vision of mass-producing small fabs. According to Tom's Hardware, Fab2's core idea is a "fab fab": it designs and builds all of its own equipment, from pumps, valves, and gas lines to lithography tools and vacuum chambers, then assembles t
2026-07-06
digitimes.com
2026-07-06
Longsys Electronics expects a sharp rise in first-half profit as global memory supply stays tight and demand from artificial intelligence-related devices strengthens. The outlook points to firmer conditions across the semiconductor market, with implications for storage prices, component availability, and technology costs worldwide.
2026-07-06
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2026-07-06
Bloomberg.com
2026-07-06
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2026-07-06
Bloomberg.com
2026-07-06
digitimes.com
2026-07-06
Samsung Electronics is trying to turn its foundry business into a bigger supplier of custom chips, with Meta Platforms and Anthropic reportedly considering Samsung for processors after its Tesla win, according to Seoul Economic Daily. The potential orders could push Samsung Foundry toward profitability sooner than expected, with industry sources estimating its medium- to long-term order backlog co
2026-07-06
digitimes.com
2026-07-06
Hon Hai Precision Industry (Foxconn) reported consolidated revenue for June 2026 on July 5, with continued demand for AI servers and cloud networking products driving record performance. Revenue for June, the second quarter, and the first half of 2026 all reached record highs for the corresponding periods.
2026-07-06
digitimes.com
2026-07-06
SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai's Lingang New Area, expanding advanced packaging capacity for high-performance computing, AI and data center chips.
2026-07-06
digitimes.com
2026-07-06
Taiwan's chipmakers walked into the 2026 helium supply shock more exposed to Qatar than any other major buyer, sourcing nearly 88% of their rare-gas imports from the Gulf state in 2025, up from 46% four years earlier. With war disrupting the Strait of Hormuz, that concentration leaves fabs vulnerable and the outlook uncertain.
2026-07-06
digitimes.com
2026-07-06
Elite Semiconductor Microelectronics Technology (ESMT), a memory IC design house, posted record monthly consolidated revenue of NT$4.85 billion (approx. US$152 million) in June 2026, up 8.48% from May and 328.35% from a year earlier, supported by rising prices for niche memory products.
2026-07-06
digitimes.com
2026-07-06
AI is reshaping the memory market in ways that could matter well beyond Taiwan and China, according to Phison Electronics founder and chief executive Pua Khein-Seng. He said growing demand for storage from global cloud operators, AI PCs, and servers may reduce the severe ups and downs that have long defined NAND flash prices.
2026-07-06
digitimes.com
2026-07-06
India accelerated its semiconductor ambitions through deeper Japan cooperation, policy advances, new manufacturing partnerships, and local technology investments, reinforcing efforts to strengthen resilient supply chains and expand domestic electronics production despite infrastructure challenges and rising component costs amid intensifying global competition.
2026-07-06
digitimes.com
2026-07-06
The global semiconductor market is entering a historically significant growth phase. According to WSTS's latest June forecast, global semiconductor revenue is projected to grow by nearly 90% in 2026, reaching approximately US$1.5 trillion. Growth is expected to remain exceptionally strong in 2027, with year-on-year expansion of around 27%, pushing total market revenue close to US$1.9 trillion.
2026-07-06
digitimes.com
2026-07-06
Samsung Electro-Mechanics signed a final agreement on July 2 with Sumitomo Chemical's Korean subsidiary Dongwoo Fine-Chem to form a joint venture that will produce glass cores, a key material used in next-generation semiconductor package substrates, the companies said.
2026-07-06
digitimes.com
2026-07-06
Micron Technology has begun construction on an expansion of its existing semiconductor plant in Higashi-Hiroshima, western Japan, as part of a JPY1.5 trillion (approx. US$9.3 billion) investment aimed at increasing production of advanced memory chips, particularly high-bandwidth memory (HBM) used in artificial intelligence (AI) processors.
2026-07-06
digitimes.com
2026-07-06
Asahi Kasei, one of the notable suppliers of Sunfort dry film photoresist in Japan, has initiated a fab expansion project in Taiwan. The newly established plant is expected to further elevate capacity performance in cutting and processing semiconductor packaging substrates.