Semiconductor News & Analysis Feed
84 articles
2026-06-05
news.google.com
2026-06-05
digitimes
2026-06-05
www.indexbox.io
2026-06-05
IndexBox
Jun 2, 2026
Jeffrey Christian Debunks Precious Metals Myths: CIA Gold, Silver Deficit, and Price Outlook
Jeffrey Christian of CPM Group debunks popular precious metals myths, including the 'CIA Gold' story and silver deficit claims, while offering a cautious price outlook for gold, sil
2026-06-05
www.fool.com
2026-06-05
The Motley Fool
Nvidia continues to deliver excellent financial performance, while the stock price increases only modestly.
Nvidia (
NVDA
+2.08%
) reported an overall fantastic quarter.
*Stock prices used were the afternoon prices of May 28, 2026. The video was published on May 30, 2026.
The Motley Fool Stock Advisor analyst team just identified what they believe are the 10 best stocks for investors to buy now
2026-06-04
www.moomoo.com
2026-06-04
Moomoo
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2026-06-04
www.caixinglobal.com
2026-06-04
Caixin Global
Huawei Technologies Co. Ltd. recently threw a conceptual bombshell into the global semiconductor industry, unveiling the Tau (τ) Scaling Law as a radical paradigm for chip design.
By shifting from traditional two-dimensional planar scaling to three-dimensional architecture, the Chinese tech giant expects to match the performance of industry-leading 1.4-nanometer chips by 2031 using the new theore
2026-06-02
finance.yahoo.com
2026-06-02
Yahoo Finance
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2026-06-02
uk.finance.yahoo.com
2026-06-02
Yahoo Finance UK
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2026-06-02
www.digitimes.com
2026-06-02
digitimes
Nvidia CEO Jensen Huang has repeatedly backed TSMC's price hikes, saying its advanced process and supply-chain services are difficult and highly valuable. As AI chip demand surges, TSMC, Samsung Electronics, SK Hynix, Micron, and other top semiconductor...
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2026-06-01
www.digitimes.com
2026-06-01
digitimes
Huawei's Tau Law is being framed in China as a new semiconductor principle, but its strategic value may lie beyond catching TSMC in process nodes. The real question is whether Huawei can combine LogicFolding, optical interconnects, and system-level scaling to...
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2026-06-01
www.digitimes.com
2026-06-01
digitimes
Huawei's Tau Law is being framed in China as a new semiconductor principle, but its strategic value may lie beyond catching TSMC in process nodes. The real question is whether Huawei can combine LogicFolding, optical interconnects, and system-level scaling to...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each tim
2026-05-30
digitimes.com
2026-05-30
When Nvidia CEO Jensen Huang stepped off a plane in Taipei on Saturday, May 23, he had already begun documenting the trip on X — night markets, fried food, and family. By the time he hosted more than 30 executives at a brick-walled restaurant six days later, the week had traced something much larger than a Computex schedule. It had mapped, dinner by dinner and post by post, the anatomy of the worl
2026-05-29
ca.finance.yahoo.com
2026-05-29
Yahoo News Canada
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2026-05-29
news.google.com
2026-05-29
Yahoo Finance Singapore
2026-05-29
www.romaniajournal.ro
2026-05-29
The Romania Journal
www.romaniajournal.ro
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2026-05-29
wkzo.com
2026-05-29
WKZO
By Eduardo Baptista and Che Pan
BEIJING, May 29 (Reuters) – Huawei’s new chip design principle focused on boosting transmission speed rather than continuing to shrink semiconductors offers a path for China to build cutting-edge chips despite U.S. sanctions, though whether it represents a true breakthrough remains to be seen.
China has been barred since 2019 from importing ASML’s most advanced ex
2026-05-29
wtvbam.com
2026-05-29
WTVB
By Eduardo Baptista and Che Pan
BEIJING, May 29 (Reuters) – Huawei’s new chip design principle focused on boosting transmission speed rather than continuing to shrink semiconductors offers a path for China to build cutting-edge chips despite U.S. sanctions, though whether it represents a true breakthrough remains to be seen.
China has been barred since 2019 from importing ASML’s most advanced ex
2026-05-29
digitimes.com
2026-05-29
Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply tighten worldwide. For readers across global tech markets, the shift means access to manufacturing capacity, not just chip design, is becoming the main determinant of who can supply the next wave of AI hardware.
2026-05-28
www.indexbox.io
2026-05-28
IndexBox
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2026-05-27
semiengineering.com
2026-05-27
Semiconductor Engineering
Combining manufacturing-resolution geometry with deterministic, solver-accurate computation changes the economics of thermal analysis for advanced 2.5D packages.
Thermal management has become the defining bottleneck in high-performance computing (HPC) and AI accelerator packaging.
Modern packages integrate high-power ASICs with multiple High Bandwidth Memory (HBM) stacks on a silicon interposer,
2026-05-26
www.indexbox.io
2026-05-26
IndexBox
May 26, 2026
High K and ALD CVD Metal Precursors Market Forecast Points Higher Toward 2035, Driven by Advanced Semiconductor Node Transitions
The global market for High K And ALD CVD Metal Precursors is a cornerstone of advanced semiconductor fabrication, supplying ultra-high-purity ch