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From Kayaku Advanced Materials Reviewed by Ify Isibor Jul 1 2026 insights from industry Meg Nagesha & Abigail Rendos Technical BD Engineer - Kayaku Advanced Materials Applications Engineering Manager - Kayaku Advanced Materials In this interview, industry experts Meg Nagesha and Abigail Rendos explain how photo-patternable bonding materials support advanced device manufacturing, helping engineers

Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply global foundry and OSAT customers, ETNewsand Yonhapreported.

By Allen Lee Published: Jun 25 2026, 1:09 PM EDT Share on Facebook Share on Twitter Share on LinkedIn Share on Reddit Share on Flipboard Share on Pocket A man walks past the logo of Samsung Electronics displayed at the company's Seocho building in Seoul on April 7, 2026. JUNG YEON-JE/AFP VIA GETTY IMAGES Samsung Electronics has put hard numbers behind a packaging bet it is making for next-genera

How BE Semiconductor Industries (BESIY) Is Turning Hybrid Bonding Demand Into a Bigger AI Packaging Growth Target Habib Ur Rehman Tue, June 23, 2026 at 9:10 AM PDT 2 min read BESI.AS -0.37% BE Semiconductor Industries N.V. (OTC:BESIY) is one of the fastest-growing high-bandwidth memory stocks to buy. The company strengthened its HBM-adjacent case on June 18, 2026, when it raised its long-term rev

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Hybrid bonding permits unprecedented connection density.

This is a paid press release. Contact the press release distributor directly with any inquiries. Semiconductor Bonding Market: USD 1.45 Billion by 2031 with Consumer Electronics Holding 38.23% Share in 2025 | Mordor Intelligence Report PR Newswire Mon, June 8, 2026 at 8:24 AM PDT 5 min read HYDERABAD, India, June 8, 2026 /PRNewswire/ -- According to Mordor Intelligence, the global semiconductor b

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