Semiconductor News & Analysis Feed
20 articles
2026-10-09
2026-10-07
2026-10-02
2026-10-01
semiengineering.com
2026-10-01
2026-10-01
semiengineering.com
2026-10-01
This article exposes a fundamental structural tension in edge AI chip design: the relentless pace of AI model evolution versus the multi-year silicon development cycle. The central insight is that real-world edge performance is governed less by peak NPU TOPS and more by system-level factors—memory b
2026-09-30
2026-09-30
www.digitimes.com
2026-09-30
2026-09-30
2026-09-22
www.benzinga.com
2026-09-22
2026-09-22
2026-09-16
www.thelec.net
2026-09-16
2026-09-16
2026-09-16
2026-09-15
www.arbiteronline.com
2026-09-15
2026-09-11
www.compositesworld.com
2026-09-11
Hunan Zerafber, a Chinese high-tech enterprise, has developed a new silicon carbide (SiC) fiber aimed at addressing signal blocking and weight challenges in consumer electronics. Traditional materials like aluminum and magnesium alloys, while lightweight and impact-resistant, block electromagnetic w
2026-09-10
2026-09-09
www.benzinga.com
2026-09-09
2026-09-09
2026-09-09
au.finance.yahoo.com
2026-09-09
2026-09-09
ca.finance.yahoo.com
2026-09-09