Semiconductor News & Analysis Feed
4468 articles
2026-06-25
www.manilatimes.net
2026-06-25
The Manila Times
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips
A new epitaxy system optimized for DRAM fabs adds a critical logic-class step-boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints
New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield
2026-06-25
bits-chips.com
2026-06-25
Bits&Chips
Headline
Japanese researcher proposes simpler high-NA EUV optics design
25 June 2026
Paul van Gerven
Editor at Bits&Chips
Reading time: 1 minute
A researcher at the Okinawa Institute of Science and Technology (OIST) has proposed a new optical architecture for high-NA EUV lithography. The approach replaces today’s highly complex optical layouts with a simpler in-line configuration that uses carefu
2026-06-25
www.msn.com
2026-06-25
MSN
Tech giants raise prices: Apple and Microsoft have increased prices on Macs, iPads and Xbox consoles due to unprecedented memory and storage cost spikes.
AI demand squeezes supply: AI data centre expansion has driven memory shortages, with DRAM prices up 98% in Q1 2026 and more increases expected.
Apple shifts chip plans: Reports suggest Apple will skip M6 Pro and Max chips, moving directly to A
2026-06-25
www.marketscreener.com
2026-06-25
marketscreener.com
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2026-06-25
siliconangle.com
2026-06-25
SiliconANGLE
Chipmaking equipment giant Applied Materials Inc. is trying to make life easier for its chip fabrication plant customers, so they can build the extremely complex 3D architectures necessary for the next generation of artificial intelligence processors.
To do this, it has unveiled a host of new chip fabrication systems that span advanced packaging, process control and dynamic-random access memory m
2026-06-25
finance.yahoo.com
2026-06-25
Yahoo Finance
This is a paid press release. Contact the press release distributor directly with any inquiries.
Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips
Applied Materials, Inc.
Thu, June 25, 2026 at 6:00 AM PDT 6 min read
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Applied Materials, Inc.
Innovations spanning DRAM and advanced packaging enable the
2026-06-25
www.globenewswire.com
2026-06-25
GlobeNewswire
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips
A new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints
New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield
2026-06-25
news.google.com
2026-06-25
Stock Titan
2026-06-25
za.investing.com
2026-06-25
Investing.com South Africa
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2026-06-25
ca.investing.com
2026-06-25
Investing.com Canada
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2026-06-25
www.investing.com
2026-06-25
Investing.com
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2026-06-25
tomshardware.com
2026-06-25
Luke James
Qualcomm has announced that it will bring all four of its Dragonfly data center product lines to China.
2026-06-25
www.fastcompany.com
2026-06-25
Fast Company
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2026-06-25
www.barrons.com
2026-06-25
Barron's
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2026-06-25
www.forbes.com
2026-06-25
Forbes
LEADERSHIP
EDITORS' PICK
Forbes Daily: AI Chip Giant SK Hynix Plans A $29 Billion Nasdaq Debut
Today’s Forbes Daily covers Elon Musk’s short-lived trillionaire run, Micron soars, gold and silver reach seven-month lows, bipartisan housing bill in doubt and more.
ByDanielle Chemtob,
Forbes Staff
andForbes Daily,
Forbes Staff.
Follow Authors
Jun 25, 2026, 07:43am EDT
Elon Musk’s first run as th
2026-06-25
www.msn.com
2026-06-25
MSN
__fail__
2026-06-25
tomshardware.com
2026-06-25
Jowi Morales
Gamers and enthusiasts just can’t catch a break from the memory chip shortage.
2026-06-25
www.barrons.com
2026-06-25
Barron's
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2026-06-25
www.barrons.com
2026-06-25
Barron's
__fail__
2026-06-25
www.forbes.com
2026-06-25
Forbes
INNOVATION
AI
Whoever Wins AI Will Count Transformers, Not Nvidia Chips
ByRobert J. Szczerba,
Contributor.
Robert J. Szczerba is a tech CEO covering AI, robotics and automation
Follow Author
Jun 25, 2026, 06:15am EDT
Summary
The US AI buildout faces a critical bottleneck: not chips, but power infrastructure. Half of planned 2026 data centers are stalled due to shortages of transformers, switc