Semiconductor News & Analysis Feed

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SEOUL, South Korea, May 26, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products. [1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-b

Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time

The Company Says iHBM Cuts Thermal Resistance By Over 30% ​SK Hynix unveiled its ‘iHBM’ technology on May 26, which significantly reduces heat generation by integrating a unified cooling element within the HBM package. (Photo source: SK Hynix)​ SK Hynix has made a bold bet on solving the heat problem, which has emerged as the biggest challenge of the artificial intelligence (AI) semiconductor era

Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs is now central to next-generation HBM competitiveness and data center reliability.

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Space-station cooling technologies are adapted to reduce overheating and throttling risks in AI data centers.

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One of the most closely watched developments in the AI server industry in recent weeks has been reported changes to the cooling architecture of Nvidia's next-generation Vera Rubin platform, a shift that has already triggered sharp swings among related...The article requires paid subscription.Subscribe Now