Semiconductor News & Analysis Feed

LG Display has unveiled a significant innovation in OLED manufacturing called FLiPP (FMM-less Innovative Pixel Patterning), which replaces traditional metal masks with photolithography. This breakthrough enhances subpixel surface area, increasing panel brightness by 1.6x and lifespan by 2.4x, while

Applied Materials unveiled two new chipmaking systems—Centris™ Spectral™ SiN ALD and Producer™ Selectra™ Mo Etch—to address critical challenges in advanced 3D semiconductor manufacturing. As the industry transitions toward gate-all-around (GAA) transistors and high-layer-count 3D NAND due to rising

Applied Materials unveiled two new chipmaking systems—Centris™ Spectral™ SiN ALD and Producer™ Selectra™ Mo Etch—to address critical challenges in advanced 3D semiconductor manufacturing. As the industry transitions toward architectures like gate-all-around (GAA) transistors and high-layer-count 3D

Manz's successful delivery of the world's first 310mm x 310mm panel-level packaging electrochemical deposition (ECD) mass-production tool represents a significant advancement in semiconductor packaging technology. This breakthrough demonstrates the industry's shift toward larger panel sizes and more