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This is a paid press release. Contact the press release distributor directly with any inquiries. Applied Materials Unveils Deposition and Selective Etch Systems to Advance 3D Chip Scaling Applied Materials, Inc. Mon, June 15, 2026 at 1:05 PM PDT 5 min read AMAT -3.00% Trade AMAT on Coinbase Trading disclosure Applied Materials, Inc. New systems enable precision materials engineering in high-aspec

New systems enable precision materials engineering in high-aspect-ratio 3D logic and memory chip structures Centris™ Spectral™ SiN ALD leverages innovative microwave plasma technology to deliver uniform silicon nitride deposition in challenging 3D structures Producer™ Selectra™ Mo Etch selectively removes molybdenum for wordline separation to enable 3D NAND scaling The new systems are being used b

Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical deposition (ECD) mass-production tool, further expanding its footprint in advanced packaging process equipment and... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time

Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical deposition (ECD) mass-production tool, further expanding its footprint in advanced packaging process equipment and demonstrating integrated capabilities spanning in-house R&D, process and system integration, and mass-production deployment.