Semiconductor News & Analysis Feed
827 articles
2026-07-01
eetimes.com
2026-07-01
OxCore GPU IP is up and running on FPGA today, CEO Raja Koduri told EE Times.
2026-07-01
finimize.com
2026-07-01
Finimize
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2026-07-01
finance.yahoo.com
2026-07-01
Yahoo Finance
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Sirin Software Joins Alif Semiconductor Partner Ecosystem as Authorized Design House
PR Newswire
Wed, July 1, 2026 at 5:49 AM PDT 1 min read
ST. PETERSBURG, Fla., July 1, 2026 /PRNewswire/ -- Sirin Software, a leading embedded software and IoT engineering services provider, today announced it has offi
2026-07-01
wccftech.com
2026-07-01
Wccftech
At the SAFE Forum 2026, Samsung announced that the development of its 1.4nm process is going smoothly, but the company also unveiled a new surprise: the company is working on an improved iteration called 1.4nm+, or SF1.4+. Additionally, a new 2nm roadmap was shared by the Korean giant during the conference as Samsung gets serious about sharing the competition pool with TSMC and Intel.
2026-07-01
www.marketbeat.com
2026-07-01
MarketBeat
Cadence Design Systems, Inc. $CDNS Shares Sold by Peregrine Capital Management LLC
Written by MarketBeat
July 1, 2026
Image from MarketBeat Media, LLC.
KEY POINTS
Peregrine Capital Management cut its Cadence Design Systems stake by 6.1% in the first quarter, selling 5,308 shares and leaving it with 81,038 shares worth about $22.5 million.
Cadence reported better-than-expected Q1 earnings, posting
2026-07-01
simplywall.st
2026-07-01
simplywall.st
United States/Electronic Equipment and Components/NYSE:KEYS
Integrated GaN MMIC Design Breakthrough Might Change The Case For Investing In Keysight Technologies (KEYS)
July 01, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
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On 30 June 2026, WIN Semiconductors and Keysight Technologies announced a joint GaN MMIC design workflow that links on-chip simulations, 3D layout checks, and
2026-07-01
www.businessweekly.co.uk
2026-07-01
Business Weekly
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2026-07-01
www.ad-hoc-news.de
2026-07-01
AD HOC NEWS
Cadence Design Systems, US12541W1027
Spectre X from Cadence Design Systems - tailored mixed-signal verification for complex SoCs
Veröffentlicht: 01.07.2026 um 11:35 Uhr, Redaktion AD HOC NEWS, Redaktionelle Verantwortung: Rafael Müller (Chefredaktion)
Spectre X from Cadence Design Systems pushes mixed-signal simulation performance for advanced SoC design teams working at 7 nm and beyond. Anyone h
2026-07-01
www.marketbeat.com
2026-07-01
MarketBeat
Patton Fund Management Inc. Has $241,000 Stake in Cadence Design Systems, Inc. $CDNS
Written by MarketBeat
July 1, 2026
Image from MarketBeat Media, LLC.
KEY POINTS
Patton Fund Management cut its Cadence Design Systems stake by 91.5% in Q1, leaving it with 869 shares valued at about $241,000.
Several analysts raised price targets on CDNS and kept bullish ratings, with the stock carrying a consensu
2026-07-01
www.newelectronics.co.uk
2026-07-01
New Electronics
www.newelectronics.co.uk
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2026-07-01
eetimes.com
2026-07-01
EU Chips Act 2.0 gets the plot right: fabs aren’t enough. Europe needs design-layer muscle and multi-foundry freedom.
2026-07-01
www.indexbox.io
2026-07-01
IndexBox
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2026-07-01
www.bisinfotech.com
2026-07-01
Bisinfotech
www.bisinfotech.com
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2026-07-01
semiengineering.com
2026-07-01
Semiconductor Engineering
In next-generation silicon, AI can interpret system behavior at scale, but only if observability is designed into the fabric as a first-class architectural capability.
Experts At The Table: In-silicon observability—also known as on-die or on-chip visibility—is becoming increasingly important for managing the performance, reliability, and security of today’s high-performance systems. Semiconductor
2026-07-01
www.bisinfotech.com
2026-07-01
Bisinfotech
www.bisinfotech.com
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2026-07-01
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2026-07-01
SamMobile
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2026-07-01
www.bisinfotech.com
2026-07-01
Bisinfotech
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2026-07-01
semiengineering.com
2026-07-01
Ann Mutschler
In next-generation silicon, AI can interpret system behavior at scale, but only if obse...
2026-07-01
digitimes.com
2026-07-01
Cloud AI demand is reshaping the seasonal cycle of the semiconductor industry, with capacity tightness spreading from front-end manufacturing to back-end packaging and testing. Since late 2025, outsourced semiconductor assembly and test, or OSAT, capacity has tightened steadily. New capacity added in 2026 has also been filled quickly, prompting multiple IC design houses to lock in capacity and pus
2026-07-01
digitimes.com
2026-07-01
SK Hynix's latest senior hiring drive has reignited debate in South Korea's semiconductor industry, with the move seen as more than routine R&D reinforcement and as a sign that competition in the high-bandwidth memory (HBM) market has entered a new stage. As AI chips demand more from memory, logic design, advanced process nodes, and packaging integration, talent with system semiconductor and found