Agentic AI on edge devices will require hardware-aware design from the start, according to Meta's Vikas Chandra, a keynote speaker at the Embedded Vision Summit.

TSMC held its annual technology symposium in Hsinchu on May 14, 2026, after its North America stop, with executives noting that AI applications are rapidly expanding from cloud data centers to edge devices — driving surging demand for semiconductor compute density, high-bandwidth connectivity, power efficiency, and thermal management. Ray Wan, director of Asia-Pacific business, said TSMC will leve

Applied Materials and TSMC have announced a partnership to accelerate semiconductor technologies for AI, aiming to speed commercialization and improve the energy efficiency of chips spanning data centers and edge devices. The collaboration promises global supply chains, cloud services, and device makers faster access to advanced nodes and reduced time from development to high-volume manufacturing.