Semiconductor News & Analysis Feed
471 articles
2026-05-29
wtvbam.com
2026-05-29
WTVB
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its
2026-05-29
whtc.com
2026-05-29
WHTC
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its
2026-05-29
simplywall.st
2026-05-29
simplywall.st
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2026-05-29
digitimes.com
2026-05-29
As AI moves from cloud environments into factories and physical systems, semiconductor design is being reshaped by new demands in speed, energy efficiency, and on-site learning. At a recent system-semiconductor seminar in South Korea, Seong-jun Jang, a research center director at the Korea Electronics Technology Institute (KETI), outlined four key architectural directions for future AI chips aimed
2026-05-29
digitimes.com
2026-05-29
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.
2026-05-29
digitimes.com
2026-05-29
Foxconn chairman Young Liu said the company is preparing to break ground on its advanced packaging plant in France while continuing to explore sovereign-AI opportunities in Africa, as the electronics manufacturer looks beyond AI servers for its next phase of growth.
2026-05-29
digitimes.com
2026-05-29
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI memory product, according to the company. The move underscores intensifying competition among memory suppliers as demand accelerates for higher-performance components used in AI computing systems.
2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-29
www.reuters.com
2026-05-29
Reuters
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2026-05-29
news.samsung.com
2026-05-29
samsung.com
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2026-05-29
electronics360.globalspec.com
2026-05-29
Electronics360
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2026-05-28
www.mymalonetelegram.com
2026-05-28
The Malone Telegram
Future Electronics Features Infineon CoolGaN™ Transistors & GaN-Based Solutions for Humanoid Robotics
59 mins ago
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Future Electronics, a global leader in electronic components distribution, is highlighting Infineon Technologies AG CoolGaN™ transistors and GaN-based solutions engineered to support the growing demands of huma
2026-05-28
digitimes.com
2026-05-28
Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive systems, drones, and industrial automation, ETNewsreported, citing industry sources.
2026-05-28
www.newelectronics.co.uk
2026-05-28
New Electronics
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Neil Tyler
28 May 2026
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www.newelectronics.co.uk
2026-05-27
New Electronics
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Neil Tyler
27 May 2026
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STMicroelectronics has launched a new range of gallium nitride (GaN)-based power semiconductors aimed at improving energy efficiency and power dens
2026-05-27
www.newelectronics.co.uk
2026-05-27
New Electronics
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27 May 2026
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2026-05-27
digitimes.com
2026-05-27
Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement has temporarily eased concerns over potential strikes, South Korea's semiconductor industry is increasingly worried that the newly expanded performance bonus structure, which guarantees employees a fixed percentage
2026-05-27
digitimes.com
2026-05-27
Printed circuit board (PCB) drill bit manufacturer Topoint Technology approved a private placement of unsecured convertible corporate bonds with a maximum issuance amount of NT$600 million (approx. US$19.10 million) at its shareholders' meeting on May 26. The company also welcomed Unimicron Technology, Gold Circuit Electronics (GCE), and Zhen Ding Technology Group (ZDT) as strategic investors.
2026-05-27
digitimes.com
2026-05-27
Kinpo Electronics outlined its 2026 core strategy at a shareholders' meeting on May 25, centering on "bearing fruit" as it builds on years of product-mix adjustments, expands into AI-related products, and accelerates its shift toward an ODM model.
2026-05-27
digitimes.com
2026-05-27
Samsung Electronics' tentative 2026 wage agreement has cleared a union vote with 73.7% approval, moving a months-long labor dispute closer to settlement while exposing a deeper divide between workers in the company's chip and consumer electronics businesses, according to Korean media reports.