Semiconductor News & Analysis Feed

Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports indicate that Google is not only set to adopt Intel's embedded multi-die interconnect bridge (EMIB) packaging for its next-generation product, but is also planning to bring in Samsung Electronics for front-end waf

Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect Bridge (EMIB) technology, according to ETNews.