Semiconductor News & Analysis Feed

20 articles
2026-10-13
semiengineering.com 2026-10-13
2026-10-13
semiengineering.com 2026-10-13
2026-09-17
wccftech.com 2026-09-17
2026-09-10
www.bloomberg.com 2026-09-10
2026-09-08
news.google.com 2026-09-08
2026-08-19
www.marketscreener.com 2026-08-19
2026-08-19
news.google.com 2026-08-19
2026-07-29
newsroom.intel.com 2026-07-29
2026-07-28
news.google.com 2026-07-28
2026-06-25
www.eejournal.com 2026-06-25
Infineon Technologies AG has announced that BRC Solar GmbH has selected Infineon’s CoolGaN™ technology as the core switching technology for its Power Optimizer. The CoolGaN™ Transistor 100V family delivers industry-leading switching performance and power handling in a compact 3 mm x 5 mm package, en
2026-06-24
www.automotiveworld.com 2026-06-24
Infineon has launched its first monolithic microwave integrated circuit (MMIC) 8Tx8Rx radar transceiver chip, the CTRX8188F, aimed at advanced driver assistance systems (ADAS) and autonomous driving. This chip enables centralized radar architectures, routing raw sensor data directly to a vehicle's c
2026-06-18
www.thefastmode.com 2026-06-18
HPE has unveiled new innovations to help enterprises transition into agentic enterprises and deploy AI into production with enhanced security, governance, and control. The integration with NVIDIA introduces tools such as the NVIDIA Agent Toolkit, Nemotron open models, NemoClaw, and OpenShell, formin
2026-06-17
news.google.com 2026-06-17
2026-06-16
tomshardware.com 2026-06-16
AMD has acquired MEXT, a startup specializing in memory tiering technology, to address growing memory constraints in data centers. MEXT's technology makes NAND flash appear as DRAM to the operating system, enabling data center operators to reduce DRAM costs while maintaining performance. By using AI
2026-06-09
www.azom.com 2026-06-09
On June 9, 2026, Oxford Instruments, a leading provider of advanced plasma processing solutions for the compound semiconductor industry, announced that its advanced etch technology has enabled ROHM Co., Ltd. to achieve in-house 200mm wafer production of 650V gallium nitride (GaN) power devices. This
2026-06-09
www.electronicsmedia.info 2026-06-09
ROHM has introduced the TSC3PAK SiC MOSFET package in June 2026, aimed at enhancing efficiency and reliability in power conversion circuits for electric vehicles. The new package features a top-side heat dissipation structure that matches the thermal performance of conventional through-hole packages
2026-06-04
www.newswire.com 2026-06-04
On June 4, 2026, Aible announced that its enterprise AI agent solution, AibleClaw, now supports NVIDIA's newly released Nemotron 3 Ultra model. This frontier-intelligence open model offers significant advantages in inference speed and cost-efficiency over other models in its class, making it suitabl
2026-06-03
blogs.nvidia.com 2026-06-03
At CVPR 2026, NVIDIA unveiled a new generation of physical AI research tools aimed at accelerating development in autonomous vehicles, robotics, and vision AI. Central to this effort is NVIDIA Cosmos 3, the world's first full omnimodel unifying vision reasoning, world modeling, and action generation
2026-06-03
bioengineer.org 2026-06-03
The Fraunhofer Institute for Applied Solid State Physics (IAF) has achieved a significant breakthrough in electric vehicle (EV) power electronics with the development of a gallium nitride (GaN)-based 800 V bidirectional DC charging module. This innovation, part of the GaN4EmoBiL project funded by Ge
2026-06-01
www.stocktitan.net 2026-06-01