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Pro Qualcomm High Bandwidth Compute aims to compete with High Bandwidth Flash and Memory by stacking LPDDR just above the CPU to 'eliminate HBM tax' News By Rahim Amir Published July 2, 2026 Taking the high, stacked LPDDR road? (Image credit: ServeTheHome) Share this article 0 Join the conversation Follow us Add us as a preferred source on Google Newsletter Subscribe to our newsletter Qualcomm i

JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources reported. According to ET News, the DRAM subcommittee completed its review, and the JEDEC board gave final approval, positioning the standard to influence AI semiconductor cost structures and substrate choices.

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