AMD CEO Lisa Su appeared in Suzhou on May 20 to attend the launch ceremony for the second-phase expansion of Suzhou TF-AMD Semiconductor Co. (also known as Suzhou Tongfu Advanced Microelectronics), underscoring AMD's growing focus on advanced packaging capacity as AI and high-performance computing demand accelerate globally.

AMD said on May 21 that it plans to invest more than US$10 billion across Taiwan's semiconductor ecosystem to deepen strategic partnerships and expand advanced packaging capacity for next-generation artificial intelligence (AI) infrastructure. The initiative aims to strengthen manufacturing capabilities, accelerate the deployment of AI systems, and support the growing demand for high-performance c

Singapore-based AI automation startup Galatek said it is tackling yield bottlenecks in micron-level packaging with AI-embedded equipment as demand for AI and high-performance computing (HPC) chips surges across Southeast Asia and global markets. The company is also pursuing a dual-track expansion spanning Southeast Asia and Taiwan.

AP Memory reported that net profit for the first quarter of 2026 rose 91% to NT$660 million (US$20.93 million) as the company scaled mass production of its S-SiCap silicon capacitor and benefited from strong demand for its IoTRAM customized memory. The Taiwan-based chip packaging and memory supplier said silicon capacitor shipments entered a ramp-up phase in the first quarter of 2026 as AI and hig

Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate the development of multi-die systems, smoothing paths to high-volume manufacturing and benefiting designers across AI, high-performance computing, automotive, and telecommunications markets worldwide—as well as techn

TSMC is facing fierce customer competition and supply shortages as demand surges for artificial intelligence and high-performance computing chips, forcing fabless chipmakers to consider limited shifts in manufacturing partners to ease constraints.

Taiwan's semiconductor testing and probe card supply chain maintained solid momentum entering 2026, driven by continued AI accelerator, high-performance computing (HPC), and advanced packaging demand.

GlobalWafers said on May 4 that its first-quarter performance reflected a transitional period, as short-term cost pressures and capacity expansion weighed on margins even as demand tied to artificial intelligence (AI) and high-performance computing began to strengthen.