BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the evening of May 20 that it had signed a three-year memorandum of understanding with US glass materials supplier Corning to cooperate in glass-based packaging substrates, foldable glass, perovskite glass substrates and optical interconnects.

As AI pushes semiconductors toward new limits in energy, memory, and interconnects, imec’s CEO says future progress will depend on deep co-optimization across the entire computing stack.

As AI data centers demand ever-faster networking speeds and more advanced optical interconnects, one of the semiconductor industry's lesser-known materials is emerging as a major constraint.