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2026-09-22
Marvell Technology (MRVL) Debuts Industry First 2nm Optical Interconnects - Yahoo Finance
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finance.yahoo.com 2026-09-22
2026-09-16
Why SoC Interconnects Have Outgrown the Bus - Semiconductor Engineering
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semiengineering.com 2026-09-16
2026-09-09
Citi: Optical Interconnects Are the 'Next HBM' — NPO Pulls Ahead with 2027 Market Entry - finance.biggo.com
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finance.biggo.com 2026-09-09
2026-09-09
China GPU developer Biren expands AI chip R&D into optical interconnects, advanced cooling
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digitimes.com 2026-09-09
2026-09-09
Qualcomm and Amazon Sign Multi-Generation Deal for Custom AI Inference Silicon and 1.6T Optical Interconnects - StorageReview.com
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www.storagereview.com 2026-09-09
2026-09-08
Qualcomm lands AWS deal for custom chips, interconnects - constellationr.com
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news.google.com 2026-09-08
2026-09-04
CPO high-density optical interconnects drive E&R's submicron 2D FAU breakthrough
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digitimes.com 2026-09-04
2026-08-21
LG enters chip packaging arena with Laser Direct Imaging machine, as TSMC's CoWoS remains constrained — maskless machine is designed to pattern fine interconnects, trading resolution for higher throughput - Tom's Hardware
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www.tomshardware.com 2026-08-21
2026-08-21
SK Hynix banks on optical interconnects to defend its HBM crown - SDxCentral
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www.sdxcentral.com 2026-08-21
2026-08-20
[Insight] Beyond HBM: SK hynix Maps the Next AI Battleground in Optical Interconnects - Korea IT Times
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news.google.com 2026-08-20
2026-08-18
Credo spearheading OCP project to develop open chiplet interconnects - SDxCentral
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news.google.com 2026-08-18
2026-08-17
China's Vertilite commits US$741M to InP laser chips for AI optical interconnects
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digitimes.com 2026-08-17
2026-07-12
SmartSens targets 2027 commercialization of Micro LED optical interconnects for AI infrastructure
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digitimes.com 2026-07-12
2026-07-10
CSP ASIC demand drives structural growth in high-speed interconnects
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digitimes.com 2026-07-10
2026-07-03
EMIB-T Roadmap, Custom HBM, HBM4 Packaging Challenges, Microfluidic Cooling, Photonic Interconnects, and More - SemiAnalysis
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newsletter.semianalysis.com 2026-07-03
As transistor scaling has slowed, advanced packaging has emerged as the primary scaling vector for chip performance enhancement. However, the increasing size and demand for high-speed interconnects in AI accelerators are pushing packaging limits. At ECTC 2026, key developments were presented, includ
Advanced PackagingEMIB-THBM4EMicrofluidic CoolingPhotonic InterconnectsAI AcceleratorsIntelTSMC
2026-06-26
AuthenX targets AI data center interconnects with plug-and-play FAU for CPO
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digitimes.com 2026-06-26
2026-06-12
Chinese chip foundry United Nova bets US$3B on AI power, optical interconnects
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digitimes.com 2026-06-12
2026-06-03
Lightmatter Joins NVIDIA NVLink Fusion and Powers Next-Generation AI Infrastructure with Photonic Interconnects - Yahoo Finance
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finance.yahoo.com 2026-06-03
2026-06-03
Lightmatter Joins NVIDIA NVLink Fusion and Powers Next-Generation AI Infrastructure with Photonic Interconnects - Business Wire
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news.google.com 2026-06-03
2026-05-29
SmartSens, Unisoc team up on Micro LED optical interconnects for AI computing
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digitimes.com 2026-05-29