Semiconductor News & Analysis Feed
20 articles
2026-08-24
www.newelectronics.co.uk
2026-08-24
2026-08-22
www.techpowerup.com
2026-08-22
2026-08-20
semiengineering.com
2026-08-20
As AI workloads demand higher bandwidth, manufacturers are increasingly adopting 2.5D and 3D packaging architectures to boost interconnect density. However, these advanced packaging techniques introduce new challenges, particularly in managing thermal expansion and electromigration. While 2.5D packa
2026-08-11
news.google.com
2026-08-11
2026-07-20
2026-07-13
2026-07-12
news.google.com
2026-07-12
2026-07-11
www.thelec.net
2026-07-11
2026-07-07
tomshardware.com
2026-07-07
Intel has revealed a new high-bandwidth memory (HBM) architecture, called Cross-Batch Memory (XBM), in a patent filed in December 2024 and published in July 2026. XBM aims to overcome the high packaging costs and complexity associated with current interposer-based HBM by shifting DRAM cell fabricati
2026-07-07
www.tomshardware.com
2026-07-07
Intel has unveiled a new high-bandwidth memory (HBM) architecture through a patent filed in December 2024, aiming to address the packaging and cost bottlenecks associated with current interposer-based HBM solutions. The proposed Cross-Batch Memory (XBM) architecture shifts DRAM cells from the front-
2026-07-03
news.google.com
2026-07-03
2026-07-01
finance.biggo.com
2026-07-01
2026-06-12
www.eenewseurope.com
2026-06-12
Belgian research hub imec has made significant progress in chip integration technology, extending its 300mm RF silicon interposer platform to enable system-level integration of III-V chiplets with Si-CMOS technology. This advancement addresses emerging mmWave and sub-THz wireless applications, as we
2026-06-10
www.indexbox.io
2026-06-10
According to IndexBox market analysis report, the glass interposer market is projected to achieve significant growth by 2035, primarily driven by the escalating demand for advanced packaging. This technological trend reflects the semiconductor industry's urgent need for higher performance and smalle
2026-06-09
www.streetinsider.com
2026-06-09
Qnity Electronics has introduced two advanced packaging materials tailored for organic interposer applications, addressing the growing demand for high-density interconnects and reliability in AI and high-performance GPU chips. The Intervia 8540HSP copper material targets AI-driven GPU applications,
2026-06-09
www.01net.it
2026-06-09
Qnity's introduction of enhanced advanced packaging materials for organic interposer applications represents a significant advancement in semiconductor packaging technology. This development addresses critical challenges in modern chip manufacturing, particularly in high-performance computing and AI
2026-06-09
za.investing.com
2026-06-09
Qnity's launch of advanced packaging materials for chip interposers represents a significant advancement in semiconductor packaging technology. As chip dimensions shrink and functionality increases, traditional packaging solutions struggle to meet the demands of high-performance computing and 5G com
2026-06-09
www.investing.com
2026-06-09
Qnity's launch of advanced packaging materials for chip interposers represents a significant advancement in semiconductor packaging technology. Chip interposers serve as critical components connecting chips to external circuits, and their performance directly impacts overall chip functionality. As s
2026-06-09
www.marketscreener.com
2026-06-09
Qnity's introduction of enhanced advanced packaging materials for organic interposer applications represents a significant advancement in semiconductor packaging technology. As chip performance demands continue to rise, traditional packaging methods struggle to meet increasing integration requiremen
2026-06-09
finance.yahoo.com
2026-06-09
On June 8, 2026, Qnity Electronics announced the introduction of two enhanced advanced packaging materials designed for organic interposer applications: Intervia™ 8540HSP multi-role copper and Cyclotene™ DF6800M dry film photo-imageable dielectric. These materials are tailored to support advanced in