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When AMD CEO Lisa Su arrived in Taiwan on May 20, she announced plans to invest more than US$10 billion with local supply-chain partners and the island's broader semiconductor ecosystem. The goal, she said, was to help secure a long-term supply of advanced... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time t

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SK hynix launches iHBM integrated cooling solution for next-generation AI memory chips - Vietnam Investment Review - VIR

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vir.com.vn 2026-05-26 Vietnam Investment Review - VIR

SEOUL, South Korea, May 26, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products. [1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-b

SK hynix HBM memory AI chips thermal management 3D stacking chip packaging semiconductor materials memory chips

Kioxia targets 2027 BiCS 10 NAND production as Samsung, SK Hynix hold back investment

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digitimes.com 2026-05-26

Kioxia is targeting 2027 production of its 10th-generation BiCS 10 NAND, a move that could help the Japanese memory maker narrow its technology gap with Samsung Electronics and SK Hynix as the South Korean rivals delay investment in their own next-generation NAND technologies, according to ZDNet Korea.

AMD and Nvidia deepen investments in Taiwan semiconductor ecosystem

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digitimes.com 2026-05-26

When AMD CEO Lisa Su arrived in Taiwan on May 20, she announced plans to invest more than US$10 billion with local supply-chain partners and the island's broader semiconductor ecosystem. The goal, she said, was to help secure a long-term supply of advanced artificial intelligence (AI) chips.

Holy Stone Enterprise says AI power surge will deepen global MLCC shortages

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digitimes.com 2026-05-26

Holy Stone Enterprise warns that AI-driven power upgrades are creating global shortages and record demand for multilayer ceramic capacitors (MLCCs), with lead times beyond 20 weeks and tighter supply expected through 2027. The developments could reshape supply chains for servers, data centers, and high-power consumer electronics worldwide, and accelerate global investment in components.

Can Qualcomm's Expanded Stellantis Tie-Up Boost Its Shares? - Zacks Investment Research

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www.zacks.com 2026-05-25 Zacks Investment Research

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Linden Rose Investment LLC Purchases New Holdings in Taiwan Semiconductor Manufacturing Company Ltd. $TSM - MarketBeat

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