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Trending Companies
Nvidia46 NVIDIA39 TSMC11 Apple10 GlobalFoundries8 Applied Materials8 ASML7 SK Hynix6 Adobe5 Samsung4 SK hynix4 Microsoft3
Trending Technologies
AI13 RTX Spark8 Nemotron 3.5 Super VL7 Advanced Packaging5 Agentic AI5 GaN5 2nm4 advanced packaging4 DRAM4 SST3 Automated Driving2 GPU2
2026-10-15
FIC Group opens Malaysia plant as optical module capacity targets 18 SMT lines
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digitimes.com 2026-10-15
2026-10-13
Malaysian states team up to back homegrown chip firms
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digitimes.com 2026-10-13
2026-10-08
Malaysia's chip push: a new island and pressure from Washington and Beijing
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digitimes.com 2026-10-08
2026-10-08
Malaysian chip designers eye new business through Japanese foundry Rapidus - The Business Times
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www.businesstimes.com.sg 2026-10-08
2026-10-07
Rapidus adds Malaysian chip designers to its semiconductor network
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digitimes.com 2026-10-07
2026-10-03
Anwar visits SIC for pit tour, welcome dinner - The Malaysian Reserve
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themalaysianreserve.com 2026-10-03
2026-10-02
Amazon Weighs US$8 Billion Nvidia Chip Sale To Investors - BusinessToday Malaysia
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www.businesstoday.com.my 2026-10-02
2026-10-02
Nvidia AI Servers Allegedly Routed Through Malaysia and Singapore In $300 Million China Scheme, Californi - Benzinga
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www.benzinga.com 2026-10-02
2026-10-02
What it takes for Malaysia to gain a foothold in advanced packaging - The Edge Singapore
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www.theedgesingapore.com 2026-10-02
2026-10-01
Infineon Expands Thailand Footprint With US$1.44 Billion Investment - BusinessToday Malaysia
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www.businesstoday.com.my 2026-10-01
2026-10-01
SEMIFIVE Signs Turnkey Contract with Mobilint to Develop Robotics AI Chip Under 'K-On-Device AI Semiconductor' Program - The Malaysian Reserve
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themalaysianreserve.com 2026-10-01
2026-10-01
Infineon eyes Thailand as potential semiconductor production hub - theedgemalaysia.com
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theedgemalaysia.com 2026-10-01
2026-09-29
Advanced Packaging is Malaysia’s Next AI Test - AMRO ASIA
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www.amro-asia.org 2026-09-29
2026-09-29
Advanced Packaging is Malaysia’s Next AI Test - AMRO ASIA
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www.amro-asia.org 2026-09-29
2026-09-28
NUS says its advanced packaging work is ahead of the foundries. It wants Malaysia in it - Tech Wire Asia
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techwireasia.com 2026-09-28
2026-09-28
South Korea's HBM-linked exports surge as Taiwan, Malaysia emerge as high-value destinations
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digitimes.com 2026-09-28
2026-09-24
Intel Malaysia expands advanced packaging capabilities in Penang for AI chips - Global Sources
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www.globalsources.com 2026-09-24
2026-09-24
Intel Malaysia expands advanced packaging capabilities in Penang for AI chips - Global Sources
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www.globalsources.com 2026-09-24
2026-09-24
Intel Malaysia expands advanced packaging as AI chips grow more complex - Tech Wire Asia
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techwireasia.com 2026-09-24
2026-09-22
[News] Korea’s HBM-Related Exports to Malaysia Soar 5.7-Fold in One Year as AI Packaging Demand Rises - TrendForce
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www.trendforce.com 2026-09-22