semiengineering.com
2026-05-27
Semiconductor Engineering
Combining manufacturing-resolution geometry with deterministic, solver-accurate computation changes the economics of thermal analysis for advanced 2.5D packages.
Thermal management has become the defining bottleneck in high-performance computing (HPC) and AI accelerator packaging.
Modern packages integrate high-power ASICs with multiple High Bandwidth Memory (HBM) stacks on a silicon interposer,