Semiconductor News & Analysis Feed

Korean chip manufacturer SK hynix had been planning to double its memory production capacity by 2030 and 2031 from current levels, even before a request from NVIDIA CEO Jensen Huang, suggests a report from the Korean media. The NVIDIA CEO wrote "please make more" on a hynix wafer at the Computex conference in Taiwan, and supply chain sources suggest that the memory manufacturer plans to expand its

Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo

Lam Research CEO Tim Archer said artificial intelligence and robotics can help chipmakers improve fab productivity as the semiconductor industry faces memory capacity constraints, chip-scaling limits, and growing demand for faster equipment delivery.

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