Semiconductor News & Analysis Feed

Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.

SmartSens and Unisoc have formed a strategic partnership to develop Micro LED high-speed optical interconnects, aiming to deliver domestic, low-power, high-bandwidth solutions for short-reach AI cluster links. The collaboration could accelerate the commercialization of Micro LED co-packaged optics (CPO) technology and strengthen China's role in global AI infrastructure supply chains, according to

Ennostar Holdings' transformation has begun to show clear results, with chairman Paul Peng saying the company's "3+1" strategy is taking shape, as higher-value applications now account for more than half of revenue. Despite continued uncertainty in the global environment, Peng remains cautiously optimistic about the second half of 2026 and expects the company to maintain relatively strong performa

As artificial intelligence workloads continue to expand, demand for memory capacity and bandwidth is growing rapidly, pushing existing GPU-HBM architectures toward their limits. According to ZDNet, researchers at a major South Korean memory manufacturer stated that memory and packaging companies are exploring a new approach that places the GPU and HBM in separate packages. Unlike traditional desig