Semiconductor News & Analysis Feed
542 articles
2026-06-16
digitimes.com
2026-06-16
A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has drawn skepticism from Taiwan industry sources, who say the timeline is likely premature and that the company remains focused on evaluating multiple advanced-packaging options.
2026-06-16
digitimes.com
2026-06-16
Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced packaging capacity, according to the latest Worldwide Semiconductor Equipment Market Statistics report from SEMI.
2026-06-16
digitimes.com
2026-06-16
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS toward CoPoS as it builds out a fuller ecosystem ahead of rivals.
2026-06-16
www.techtimes.com
2026-06-16
Tech Times
By Allen Lee
Published: Jun 15 2026, 15:57 PM EDT
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The TSMC logo is displayed at the Taiwan Semiconductor Manufacturing Company branch and Innovation Museum, highlighting the company branding and signage inside and outside the site in Hsinchu, Taiwan, January 27, 2026. JIMMY BEUNARDEAU/GETTY IMA
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
TSMC, TW0002330008
AI packaging push: how TSMC’s CoWoS advanced packaging is scaling for the next wave
15.06.2026 - 19:54:24 | ad-hoc-news.de
TSMC’s CoWoS advanced packaging platform is at the center of the AI accelerator boom. Capacity for the 2.5D chip-on-wafer-on-substrate technology is ramping hard, with the foundry targeting well over 100,000 wafers per month as hyperscaler demand keeps clim
2026-06-15
simplywall.st
2026-06-15
simplywall.st
United States/Semiconductors/NasdaqGS:AMKR
Amkor Technology (AMKR) Is Up 21.2% After Outlining AI-Focused Advanced Packaging Expansion Strategy
June 15, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
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Amkor Technology recently reported record Q1 2026 revenue and used its first Investor Day in nearly 20 years to outline ambitious long-term growth targets anchored in advanced packagi
2026-06-15
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2026-06-15
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2026-06-15
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2026-06-15
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2026-06-15
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2026-06-15
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TSMC remains the undisputed leader in advanced contract chip manufacturing. Samsung has made some strides recently but the gap between the two is quite significant and unlikely to be closed any time soon.
However, there's one area where Samsung enjoys the advantage and the lead, and it appears that TSMC now wants to ta
2026-06-15
www.taiwannews.com.tw
2026-06-15
Taiwan News
www.taiwannews.com.tw
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2026-06-15
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2026-06-15
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2026-06-15
focusmalaysia.my
2026-06-15
Focus Malaysia
focusmalaysia.my
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2026-06-15
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2026-06-15
BusinessToday Malaysia
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2026-06-15
www.digitimes.com
2026-06-15
digitimes
As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes...
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2026-06-15
www.digitimes.com
2026-06-15
digitimes
SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for HBM4, a move that underscores mounting pressure on advanced memory suppliers to keep pace with demand from AI infrastructure.
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2026-06-15
digitimes.com
2026-06-15
Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical deposition (ECD) mass-production tool, further expanding its footprint in advanced packaging process equipment and demonstrating integrated capabilities spanning in-house R&D, process and system integration, and mass-production deployment.
2026-06-15
digitimes.com
2026-06-15
SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for HBM4, a move that underscores mounting pressure on advanced memory suppliers to keep pace with demand from AI infrastructure.
2026-06-15
digitimes.com
2026-06-15
South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics and SK Hynix accelerated investment in advanced DRAM and high-bandwidth memory (HBM4), generating demand across front-end tools, advanced packaging, and inspection equipment. The shift toward high-end process and packaging capabilities for AI memory has driven new con
2026-06-15
digitimes.com
2026-06-15
Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports indicate that Google is not only set to adopt Intel's embedded multi-die interconnect bridge (EMIB) packaging for its next-generation product, but is also planning to bring in Samsung Electronics for front-end waf
2026-06-15
digitimes.com
2026-06-15
As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes for local production and service, faster ramps for AI chip capacity, and customer demands for supply chain resilience amid de-Americanization