Semiconductor News & Analysis Feed

542 articles
2026-06-15
www.thelec.net 2026-06-15 thelec.net
Samsung Electronics' Onyang NanoCity. (Photo: Samsung Electronics) Samsung Electronics and SK hynix are in discussions to build their first semiconductor back-end packaging plants in Korea's Honam region, according to industry sources, with multiple candidate locations under consideration. According to industry sources on June 14, Samsung Electronics is reviewing Gwangju and Saemangeum as potent
2026-06-15
www.digitaltrends.com 2026-06-15 Digital Trends
Making chips smaller has dominated the semiconductor conversation for years, but TSMC’s next big leap may come from how those chips are packaged instead. According to analyst Ming-Chi Kuo, the company is developing a new Chip-on-Panel-on-Substrate, or CoPoS, technology that promises lower manufacturing costs while delivering better performance for future AI processors. TSMC’s CoPoS packaging coul
2026-06-14
www.digitimes.com 2026-06-14 digitimes
Chunghwa Leading Photonics Tech, a subsidiary of Chunghwa Telecom, is set to list on the Taipei Emerging Stock Board. The company has recorded record-high revenue and gross margin in the first four months of 2026, boosted by rising demand in Industry 5.0... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time the
2026-06-14
digitimes.com 2026-06-14
Chunghwa Leading Photonics Tech, a subsidiary of Chunghwa Telecom, is set to list on the Taipei Emerging Stock Board. The company has recorded record-high revenue and gross margin in the first four months of 2026, boosted by rising demand in Industry 5.0 applications, advanced semiconductor process inspection, and AI data center optical communication. With short-wave infrared (SWIR) transmissive a
2026-06-13
digitimes.com 2026-06-13
Linkotech said its fan-out panel-level packaging rollout is showing early momentum, with certification from a North American low-Earth-orbit satellite communications customer and first equipment deliveries completed in the first half of 2026. The company said related sales could quickly rise to double digits as a share of annual revenue, with implications for supply chains worldwide.
2026-06-12
www.quiverquant.com 2026-06-12 Quiver Quantitative
Amkor Technology, Inc. (AMKR) is up 7.6% today. Here is some analysis on what might have caused this price movement. Analysis: The day’s specific catalyst is not clearly identifiable from widely circulated company news, but the move appears consistent with renewed optimism around Amkor’s advanced packaging roadmap and multi-year growth targets discussed recently. This could also be momentum tied
2026-06-12
mezha.ua 2026-06-12 Mezha
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2026-06-12
www.digitimes.com 2026-06-12 digitimes
Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point in its bid to capture a larger share of the AI chip supply chain, according to industry sources and Korean media reports. Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they vis
2026-06-12
news.futunn.com 2026-06-12 富途牛牛
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2026-06-12
www.electronicsforyou.biz 2026-06-12 Electronics For You BUSINESS
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2026-06-12
digitimes.com 2026-06-12
The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers and supply chains, the shift suggests stronger demand for Taiwan's packaging and testing firms, alongside a broader rebalancing of semiconductor production.
2026-06-12
digitimes.com 2026-06-12
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these high-frequency, high-efficiency chips, the industry is driving an architectural shift: shrinking inverter volumes, eliminating heavy copper basepl
2026-06-12
digitimes.com 2026-06-12
Sigurd announced that its May revenue reached a historic high, driven by overseas customer expansion, stronger demand for AI-related chips, and rising use of advanced packaging capacity. The result suggests continued momentum in global semiconductor supply chains, with implications for networking, memory, and high-performance computing markets worldwide.
2026-06-12
digitimes.com 2026-06-12
Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point in its bid to capture a larger share of the AI chip supply chain, according to industry sources and Korean media reports.
2026-06-11
news.futunn.com 2026-06-11 富途牛牛
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2026-06-11
digitimes.com 2026-06-11
Market chatter about TSMC has intensified, with reports that its advanced process and packaging prices will rise again in the second half of 2026 and 2027, while some Google TPU production could shift to Intel, and some AMD products could be made by Samsung Electronics. TSMC CFO Wendell Huang recently told the media that global inflation and overseas fab expansion have indeed pushed up operating c
2026-06-11
digitimes.com 2026-06-11
Amkor Technology Korea is considering investing about KRW1 trillion (approx. US$650 million) to expand its chip packaging and testing facilities in the South Korean city of Gwangju, according to Korean media reports and city officials. The company has not officially announced the plan.
2026-06-11
digitimes.com 2026-06-11
Applied Materials said artificial intelligence (AI) is reshaping the global semiconductor industry and could drive years of heavy investment in chipmaking, packaging, and materials engineering. The shift matters far beyond one company, because AI demand is increasing worldwide and is expected to influence data centers, device costs, energy use, and the pace of technology development.
2026-06-11
www.newelectronics.co.uk 2026-06-11 New Electronics
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2026-06-11
news.alphastreet.com 2026-06-11 AlphaStreet
Home / Analysis / TSMC (TSM) Has a Foundry-and-Packaging Moat Bigger Than the AI Trade ANALYSIS TSMC (TSM) Has a Foundry-and-Packaging Moat Bigger Than the AI Trade NYSE $TSM June 10, 2026 5 min read X in f Introduction Taiwan Semiconductor Manufacturing Co. (NYSE: TSM) is often discussed as the cleanest public-market way to play artificial intelligence chip demand. That framing is not wrong, but