Semiconductor News & Analysis Feed
541 articles
2026-07-02
www.koreaherald.com
2026-07-02
The Korea Herald
This undated file photo shows SK hynix Inc.'s factory in Cheongju, 113 kilometers south of Seoul. (SK hynix Inc.)
An industrywide 392 trillion-won ($252.5 billion) investment will be injected into the central Chungcheong area, including high bandwidth memory fabs and packaging facilities by Samsung Electronics Co. and SK hynix, as part of the government's drive to spread artificial intelligence-l
2026-07-02
www.koreatimes.co.kr
2026-07-02
The Korea Times
An artist's rendering of SK hynix's P&T7 packaging fab in Cheongju, North Chungcheong Province / Courtesy of SK hynix
An industrywide 392 trillion-won ($252.5 bil.) investment will be injected into the central Chungcheong area, including high bandwidth memory (HBM) fabs and packaging facilities by Samsung Electronics and SK hynix, as part of the government's drive to spread artificial intelligenc
2026-07-02
en.yna.co.kr
2026-07-02
Yonhap News Agency
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SEOUL, July 2 (Yonhap) -- An industrywide 392 trillion-won (US$252.5 billion) investment will be injected into the central Chungcheong area, including high bandwidth memory (HBM) fabs and packaging facilities by Samsung Electronics Co. and SK hynix, as part of the government's drive to spread artificial intell
2026-07-01
www.trendforce.com
2026-07-01
TrendForce
[News] ASE Reportedly Raises Advanced Packaging Quotes by More Than 20% in Latest AI-Driven Price Hike
2026-07-01 Semiconductors editor
News
Please note that this article cites information from MoneyDJ, Liberty Times, and Economic Daily News.
AI-driven semiconductor demand is reportedly fueling another round of price increases across the OSAT industry. According to MoneyDJ, citing indust
2026-07-01
finance.biggo.com
2026-07-01
finance.biggo.com
TSMC's (2330.TW) advanced packaging technology roadmap is undergoing a major shift. Market sources indicate the company plans to gradually transition from current silicon interposers to its "CoPoS" large-size glass interposer technology around 2029. This move is viewed as the most critical strategic decision in the advanced packaging arena for the next decade and is expected to exert significant p
2026-07-01
digitimes.com
2026-07-01
South Korea's government laid out a detailed plan on June 30 for building its southwest region into a major new semiconductor production base, with SK, Samsung Electronics and Amkor outlining a combined KRW896 trillion (approx. US$581 billion) in investment covering memory chip fabs, AI data centers and advanced packaging.
2026-07-01
digitimes.com
2026-07-01
Cloud AI demand is reshaping the seasonal cycle of the semiconductor industry, with capacity tightness spreading from front-end manufacturing to back-end packaging and testing. Since late 2025, outsourced semiconductor assembly and test, or OSAT, capacity has tightened steadily. New capacity added in 2026 has also been filled quickly, prompting multiple IC design houses to lock in capacity and pus
2026-07-01
digitimes.com
2026-07-01
SK Hynix's latest senior hiring drive has reignited debate in South Korea's semiconductor industry, with the move seen as more than routine R&D reinforcement and as a sign that competition in the high-bandwidth memory (HBM) market has entered a new stage. As AI chips demand more from memory, logic design, advanced process nodes, and packaging integration, talent with system semiconductor and found
2026-07-01
www.indexbox.io
2026-07-01
IndexBox
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2026-07-01
finance.yahoo.com
2026-07-01
Yahoo Finance
TSMC targets 2029 for panel-level CoPoS packaging in AI chip push - DigiTimes
Luke Juricic
June 30, 2026 4 min read
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Investing.com -- Taiwan Semiconductor Manufacturing (NYSE:TSM) is accelerating development of a next-generation AI chip packaging technology called CoPoS that shifts production from round 12-inch wafe
2026-07-01
simplywall.st
2026-07-01
simplywall.st
United States/Semiconductors/NYSE:TSM
TSMC (NYSE:TSM) And Amkor Sign 10 Year Arizona Chip Packaging Deal
July 01, 2026
Simply Wall St
Reviewed by Bailey Pemberton
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TSMC and Amkor have agreed to a 10 year partnership focused on advanced semiconductor packaging and testing in Arizona.
The collaboration is aimed at supporting US chip supply for AI and high performance computing applica
2026-07-01
www.investing.com
2026-07-01
Investing.com
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2026-06-30
news.google.com
2026-06-30
EDN - Voice of the Engineer
2026-06-30
www.indexbox.io
2026-06-30
IndexBox
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2026-06-30
www.thelec.net
2026-06-30
thelec.net
Applied Materials’ enhanced Centura Prime Epi system (Photo=Applied Materials)
Applied Materials has introduced six new semiconductor manufacturing systems for DRAM and advanced packaging, expanding its portfolio of 3D semiconductor equipment aimed at improving the performance and power efficiency of next-generation memory used in artificial intelligence (AI) processors.
The company unveiled
2026-06-30
www.digitimes.com
2026-06-30
digitimes
As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating its push into 2nm-and-below nodes as well as advanced packaging technologies such as CoWoS. Industry sources said the AI-driven...
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2026-06-30
www.digitimes.com
2026-06-30
digitimes
As Taiwan becomes the core of the global AI hardware supply chain, Qnity — the century-old company spun off from US chemicals giant DuPont and separately listed — is likewise expanding its production capacity investment in Taiwan. Asia-Pacific president...
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2026-06-30
www.digitimes.com
2026-06-30
digitimes
As Taiwan becomes the core of the global AI hardware supply chain, Qnity — the century-old company spun off from US chemicals giant DuPont and separately listed — is likewise expanding its production capacity investment in Taiwan. Asia-Pacific president...
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2026-06-30
biz.chosun.com
2026-06-30
Chosunbiz
By
Jeong Du-yong
Published 2026.06.30. 15:27
Image of HANMI Semiconductor's 2.5D TC Bonder 40 equipment./Courtesy of HANMI Semiconductor
HANMI Semiconductor said on the 30th it will launch a new tool, "2.5D TC Bonder 40," which supports the 2.5-dimensional (D) packaging process for AI semiconductors. The company plans to supply equipment to global foundries and outsourced semiconductor assembly
2026-06-30
www.mk.co.kr
2026-06-30
매일경제
www.mk.co.kr
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