Semiconductor News & Analysis Feed

99 articles
2026-05-22
smbtech.au 2026-05-22 SMBtech
About Us Newsletter T&Cs Privacy Policy Contact Us HPL Instagram LinkedIn TikTok Twitter/X YouTube BLOG FEATURES NEWS REACTIONS THOUGHT LEADERSHIP HomeNewsSydney-Founded Diraq Signs US$38 Million Letter Of Intent Under CHIPS Act For Silicon Quantum Processors Sydney-Founded Diraq Signs US$38 Million Letter Of Intent Under CHIPS Act For Silicon Quantum Processors Staff Writer May 22, 2026 News
2026-05-22
finance.yahoo.com 2026-05-22 Yahoo Finance
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2026-05-22
simplywall.st 2026-05-22 simplywall.st
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2026-05-22
quantumzeitgeist.com 2026-05-22 Quantum Zeitgeist
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2026-05-22
root-nation.com 2026-05-22 Root-Nation.com
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2026-05-21
www.manilatimes.net 2026-05-21 The Manila Times
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2026-05-21
www.techpowerup.com 2026-05-21 TechPowerUp
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2026-05-21
www.gurufocus.com 2026-05-21 GuruFocus
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2026-05-21
www.manilatimes.net 2026-05-21 The Manila Times
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2026-05-21
news.google.com 2026-05-21 AMD
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2026-05-20
tspasemiconductor.substack.com 2026-05-20 semivision
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2026-05-19
eetimes.com 2026-05-19 Majeed Ahmad
Empower Semiconductor’s integrated voltage regulators (IVRs) can be placed directly inside an AI processor package.
2026-05-19
www.indexbox.io 2026-05-19 IndexBox
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2026-05-19
semiengineering.com 2026-05-19 Semiconductor Engineering
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2026-05-13
liliputing.com 2026-05-13 Liliputing
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2026-05-09
en.gamegpu.com 2026-05-09 GameGPU
Qualcomm plans to launch an expanded processor lineup in the fourth quarter of 2026 to ensure device diversification. The company will introduce the flagship Snapdragon 8 Elite Gen 6 and Gen 6 Pro solutions based on TSMC's 2 nm process technology. The use of new lithography significantly increases production costs, forcing electronics manufacturers to seek ways to maintain profits amid the protrac
2026-05-05
www.moomoo.com 2026-05-05 Moomoo
2026-04-14
eetimes.com 2026-04-14 Pablo Valerio
BSC and UPC launch a spin-off creating auditable processor architecture for European critical infrastructure.
digitimes.com
Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin's Load Port products, delivering edge AI capabilities for semiconductor panel-level packaging (PLP) equipment. The collaboration positions Hiwin's Load Port as the smart edge node in front-end modules, aiming to improve real-time image processing, status se