Semiconductor News & Analysis Feed
318 articles
2026-06-16
digitimes.com
2026-06-16
Researchers and chipmakers presented new logic, memory, and device architectures at the 2026 IEEE/JSAP VLSI Technology and Circuits Symposium in Honolulu, with several results pointing toward pilot production and mass manufacturing.
2026-06-16
www.pymnts.com
2026-06-16
PYMNTS.com
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2026-06-16
www.houstonchronicle.com
2026-06-16
Houston Chronicle
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2026-06-15
www.taiwannews.com.tw
2026-06-15
Taiwan News
www.taiwannews.com.tw
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2026-06-15
en.prnasia.com
2026-06-15
PR Newswire Asia
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2026-06-15
www.ad-hoc-news.de
2026-06-15
AD HOC NEWS
Micron’s, HBM
Micron’s HBM Production Is Sold Out Through 2026, but the Stock’s Next Move Hinges on June 24 Earnings
15.06.2026 - 09:31:26 | boerse-global.de
Micron sold all HBM output for 2026 under multi-year contracts; 2027 capacity already queued. Stock up 750% in a year, but near-term direction depends on June 24 Q3 earnings report.
Micron’s - Micron’s HBM Production Is Sold Out Through 202
2026-06-15
digitimes.com
2026-06-15
Tsang Yow is preparing to broaden its manufacturing footprint in Malaysia, a move that could help global semiconductor supply chains become more regional, resilient, and tariff-proof. The drivetrain systems maker expects trial production at the new plant before the end of 2026, as demand tied to artificial intelligence and advanced chips reshapes sourcing patterns worldwide.
2026-06-15
digitimes.com
2026-06-15
SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for HBM4, a move that underscores mounting pressure on advanced memory suppliers to keep pace with demand from AI infrastructure.
2026-06-15
digitimes.com
2026-06-15
As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes for local production and service, faster ramps for AI chip capacity, and customer demands for supply chain resilience amid de-Americanization
2026-06-15
digitimes.com
2026-06-15
Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical deposition (ECD) mass-production tool, further expanding its footprint in advanced packaging process equipment and demonstrating integrated capabilities spanning in-house R&D, process and system integration, and mass-production deployment.
2026-06-14
www.thelec.net
2026-06-14
thelec.net
Jun Young-hyun, vice chairman and head of the Device Solutions division at Samsung Electronics. (Photo: THE ELEC)
Samsung Electronics may participate in production of some components for Google's next-generation artificial intelligence semiconductor "Icefish," according to a report.
US technology media outlet The Information reported on June 11 local time that Google is discussing plans to have
2026-06-13
digitimes.com
2026-06-13
As cloud service providers ramp up investment in AI infrastructure, Edom chairman Wayne Tseng said rising costs for materials, production equipment and labour will keep overall market supply tight in the second half of 2026, with price increases likely to continue. He also said AI is moving from the cloud into enterprise applications, with power, cybersecurity, optics and the medical sector set to
2026-06-13
digitimes.com
2026-06-13
ITE Tech said its embedded controller chip and HDMI 2.1 retimer have been adopted by a US agentic AI computing platform, with mass production expected as early as the second half of 2026. The win could ripple through global PC supply chains, as the company prepares to serve major brand customers and ODM partners worldwide.
2026-06-13
www.theregister.com
2026-06-13
The Register
SYSTEMS
SK Hynix to boost memory production 3x ... you can wait another 8 years, right?
We're moving as fast as we can, says SK Group chair
Tobias Mann
Systems editor
Published Fri 12 Jun 2026 // 21:05 UTC
Amid the unrelenting demand for AI infrastructure, SK Hynix, the world’s largest supplier of HBM memory used in high-end GPUs, now expects to triple its wafer capacity. You'll just have to w
2026-06-12
www.chosun.com
2026-06-12
조선일보
By Seongmin K
Published 2026.06.13. 00:44
Samsung Electronics Hwaseong Campus foundry. /Courtesy of Samsung Electronics
Samsung Electronics’ foundry business (semiconductor contract manufacturing) is approaching profitability as it secures more orders. The Information, a U.S. IT-focused media outlet, reported on the 11th (local time) that Google is considering producing components for its next-g
2026-06-12
eetimes.com
2026-06-12
NoPo scales HiPco single-walled carbon nanotube output for sub-2-nm chips and anodes.
2026-06-12
www.trendforce.com
2026-06-12
TrendForce
[News] Samsung Reportedly in Talks for Google 2nm TPU I/O Die Order; 2028 Mass Production Eyed
2026-06-12 Semiconductors editor
News
Please note that this article cites information from Business Korea, The Information, Reuters, The Korea Herald, and ETNews.
Google is reportedly considering Samsung for part of its next-generation AI processor production. According to Business Korea, citin
2026-06-12
www.tweaktown.com
2026-06-12
TweakTown
The current memory crisis means that one of the only real ways to ease the burden on the consumer market and meet the insatiable demand from the AI and data center sectors is for key players to ramp up production of existing and next-gen memory chips. As one of the biggest players in the space, SK hynix is looking to do just that and, in the process, triple its wafer production.2VIEW GALLERY - 2 I
2026-06-12
www.bitget.com
2026-06-12
Bitget
On June 12, Infineon Technologies AG announced that it is preparing to launch its largest single investment to date—a semiconductor factory costing €5 billion (approximately 39.2 billion RMB). The construction of this factory has received subsidies from the European Union, aimed at increasing chip production. Infineon's Chief Operating Officer Alexander Gorski stated on-site this week that this po
2026-06-12
digitimes.com
2026-06-12
The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers and supply chains, the shift suggests stronger demand for Taiwan's packaging and testing firms, alongside a broader rebalancing of semiconductor production.