962 articles
2026-05-06
digitimes.com
2026-05-06
Export controls on indium phosphide (InP) risk prolonging supply strains in the compound semiconductor market, GCS Holdings warned, affecting optical and RF component makers worldwide. The company said it has secured capacity and diversified sourcing ahead of the second half of 2026, signaling potential relief from first-half 2026 constraints for global customers and partners.
2026-05-06
digitimes.com
2026-05-06
Singapore semiconductor equipment and testing company AEM is facing a dual challenge of "physics and cost" as the AI era rewrites the limits and supply-chain logic of chip testing, CEO Samer Kabbani said. AI is also driving up to US$7 trillion in global infrastructure investment, he said, while forcing the industry to adapt to faster product cycles and far larger, more power-hungry packages.
2026-05-06
digitimes.com
2026-05-06
At SEMICON Southeast Asia 2026, SEMI President and CEO Ajit Manocha delivered a clear message: the semiconductor industry is entering a "multi-trillion-dollar journey," but capturing that growth will depend less on ambition and more on coordination, ecosystems, and long-term strategy.
2026-05-06
digitimes.com
2026-05-06
Vanguard International Semiconductor (VIS) said on May 5 that it has secured support from TSMC for a new interposer foundry line at its 12-inch Singapore fab, alongside a broader push into the CoWoS supply chain. The company said the move will accelerate capacity expansion and lower capital expenditure requirements as demand stabilizes after year-endinventory corrections.
2026-05-06
www.chartmill.com
2026-05-06
ChartMill
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2026-05-06
www.marketbeat.com
2026-05-06
MarketBeat
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2026-05-06
www.newelectronics.co.uk
2026-05-06
New Electronics
As demand for high-performance AI chips rises, competition for 3nm and below fabrication capacity, along with advanced packaging technologies such as 2.5D and 3D integration, is becoming increasingly intense.One of the most persistent bottlenecks has been in advanced packaging, especially chip-on-wafer-on-substrate (CoWoS) technology. Shortages have extended beyond fabrication itself, affecting up
2026-05-06
www.benzinga.com
2026-05-06
Benzinga
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2026-05-06
www.wsgr.com
2026-05-06
Wilson Sonsini
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2026-05-06
www.morningstar.com
2026-05-06
Morningstar
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2026-05-06
semiengineering.com
2026-05-06
Semiconductor Engineering
A new technical paper, “AMMA: A Multi-Chiplet Memory-Centric Architecture for Low-Latency 1M Context Attention Serving,” was published by researchers at UC San Diego, Columbia University, Yonsei University, NVIDIA, and Samsung.Abstract“All current LLM serving systems place the GPU at the center, from production-level attention-FFN disaggregation to NVIDIA’s Rubin GPU-LPU heterogeneous platform. Ev
2026-05-06
www.semiconductor-today.com
2026-05-06
Semiconductor Today
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2026-05-06
www.marketwatch.com
2026-05-06
MarketWatch
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2026-05-06
www.zacks.com
2026-05-06
Zacks Investment Research
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2026-05-06
www.cnbc.com
2026-05-06
CNBC
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2026-05-06
finance.yahoo.com
2026-05-06
Yahoo Finance
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2026-05-06
news.stonybrook.edu
2026-05-06
SBU News
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2026-05-05
www.tikr.com
2026-05-05
TIKR.com
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2026-05-05
www.heygotrade.com
2026-05-05
Gotrade
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2026-05-05
www.investing.com
2026-05-05
Investing.com
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