Semiconductor News & Analysis Feed
26 articles
2026-06-15
www.digitimes.com
2026-06-15
digitimes
China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026 batch shipped at the end of May following an earlier release in 2025, easing a capacity bottleneck in the optical...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit t
2026-06-15
digitimes.com
2026-06-15
China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026 batch shipped at the end of May following an earlier release in 2025, easing a capacity bottleneck in the optical communications market. Taiwanese compound semiconductor suppliers including Visual Photonics Epitaxy (VPEC) and Global Communication Semiconductors (GCS)
2026-06-15
digitimes.com
2026-06-15
LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand for substrates used in AI servers, 5G smartphones, and on-device AI chips. The expansion targets RF-SiP, FC-CSP, and FC-BGA substrates, as substrate suppliers adjust capacity plans to stronger demand from advanced mobile devices and AI infrastructure.
2026-06-12
news.futunn.com
2026-06-12
富途牛牛
__fail__
2026-06-12
digitimes.com
2026-06-12
Taiwan's semiconductor and electronics supply-chain companies continued to post generally firm sales in May, according to monthly revenue data and company disclosures, with the strongest accumulated growth concentrated in AI-linked logic, testing, substrate, and copper-clad laminate suppliers.
2026-06-11
digitimes.com
2026-06-11
AI infrastructure demand is lifting high-end PCB orders, but fresh bottlenecks are emerging in the upstream copper-clad laminate (CCL) supply chain. T-glass glass fiber cloth remains tight after disrupting the high-end ABF substrate market. HVLP4 copper foil is set to become the next constraint in the second half of 2026.
2026-06-10
www.mk.co.kr
2026-06-10
매일경제
사진 확대
"We’ll cover the investment costs, so please secure the substrate supply first."
Competition to secure supply chains in the artificial intelligence (AI) semiconductor market is entering a new phase. Just one or two years ago, High Bandwidth Memory (HBM) was the hardest component to obtain. Concerns then shifted to shortages of general-purpose DRAM and NAND flash memory, and now semiconducto
2026-06-10
www.moomoo.com
2026-06-10
Moomoo
To create a seamless experience and for website quality and improvement purposes, we use cookie technologies for verification and quality purposes, to personalize the content presented, and to provide advertising that may be of specific interest to you. Learn our Privacy Policy here.
智通财经APP获悉，光大证券发布研报称，玻璃基板凭借其优异特性，逐步成为新一代先进封装介质。当前TGV玻璃基板正处于从实验室基础研究向量产工程化跨越的历史性节点，且呈国外进度领先、国内加速追赶态势。建议紧盯下游客户验证与量产线建
2026-06-09
digitimes.com
2026-06-09
LG Innotek is expanding semiconductor substrate production in Vietnam as rising demand for server components reshapes capacity across the substrate industry, fueling expectations that supply of RF-SiP substrates used in premium smartphones could tighten.
2026-06-08
digitimes.com
2026-06-08
LG Innotek is accelerating its push into advanced semiconductor packaging, announcing plans to expand its substrate manufacturing operations in Vietnam as it seeks to transform the business into a key growth engine and generate more than KRW3 trillion (approx. US$1.9 billion) in annual revenue by 2030.
2026-06-07
digitimes.com
2026-06-07
Zhen Ding Technology Group reported that May consolidated revenue reached a 2026 high as robust demand for high-end AI products drove significant year-over-year growth, the company said. The firm attributed the performance to a sharp uptick in server and optical module shipments, which rose nearly 2.5 times year-over-year, and strong momentum in IC substrate sales, which grew nearly 80% year-over-
2026-06-05
www.trendforce.com
2026-06-05
TrendForce
[News] Glass Substrates Eye 2027 Launch, Scale Toward 2030 as CoWoS Costs Rise and Hyperscaler Demand Grows
2026-06-05 Semiconductors editor
News
Please note that this article cites information from Sisa Journal, Economic Daily News, Commercial Times, Forbes and The Elec.
As AI chips continue to scale in size and complexity, demand is rising for next-generation packaging and substrate so
2026-06-04
www.moomoo.com
2026-06-04
Moomoo
消息面上，随着英伟达等AI芯片功耗飙升，传统硅基电源架构已触及物理极限。行业正加速向800V高压直流(HVDC)架构过渡，碳化硅成为AI服务器固态变压器及电源管理的必选材料。英飞凌、意法半导体等巨头明确表示，AI数据中心的部署导致多款功率器件出现严重供应短缺。
公开资料显示，天岳先进在8英寸碳化硅衬底领域占据全球领先份额，12英寸完成样品研发、送样、小批量试样供货。据悉，天岳先进的12英寸SiC衬底进入台积电供应链验证阶段，作为下一代CoWoS中介层备选方案开展送样测试。用作替代硅中介层以解决高性能GPU的散热瓶颈。
Tianyue Advanced Materials (02631.HK) rose nearly 7% in early trading. As of the time of writing, it was up 3.27% at HK$104.1, with a tr
2026-06-04
news.futunn.com
2026-06-04
富途牛牛
__fail__
2026-06-04
www.digitimes.com
2026-06-04
digitimes
Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing power and energy efficiency. The concept is increasingly seen as a key route...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each tim
2026-05-31
www.techtimes.com
2026-05-31
Tech Times
Two separate announcements on May 29 landed in the same corner of the semiconductor industry, and their combined implications for South Korea's chipmakers are more significant than either story suggests on its own. Nikon's new chief executive told Nikkei Asia that the Japanese optics maker is in advanced talks with major chipmakers in the United States and Asia to supply lower-priced deep-ultravio
2026-05-30
digitimes.com
2026-05-30
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's semiconductor manufacturing ecosystem beyond its existing design and technology operations.
2026-05-30
www.digitimes.com
2026-05-30
digitimes
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they v
2026-05-29
digitimes.com
2026-05-29
Unimicron said it will push advanced substrate and AI system-board upgrades in 2026 to capture accelerating demand for AI-related ASICs and switches, aiming for record revenue that would exceed its 2022 peak. The IC substrate and printed circuit board maker announced the strategy at its annual shareholders' meeting at the end of May, citing a shift in demand away from GPUs and CPUs toward ASICs, s
2026-05-27
www.prnewswire.com
2026-05-27
PR Newswire
LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC
NEWS PROVIDED BY
LG Innotek
May 27, 2026, 08:00 ET
SHARE THIS ARTICLE
LG Innotek to participate in ECTC for the first time in 2026, joining 135 leading global semiconductor companies
To exhibit two types of large FC‑BGA substrates for AI applications and innovative chip‑embedding