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2026-08-24
[News] Hot Chips 2026: Samsung’s zHBM Claims 70% Power-Efficiency Gain; SK hynix Evaluates Intel EMIB - TrendForce
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www.trendforce.com 2026-08-24
2026-08-24
Samsung Unveils Three-Stage HBM Roadmap: Ultimate Form zHBM Stacks DRAM Directly Atop Compute Chips - finance.biggo.com
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finance.biggo.com 2026-08-24
2026-08-24
Samsung Establishes "Three-Stage HBM Roadmap": Paving the Way for True 3D zHBM by Directly Stacking DRAM on Compute Chips - Moomoo
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www.moomoo.com 2026-08-24
2026-08-24
Samsung Leverages Advanced Logic Processes To Advance HBM As It Works On Its Next-Gen zHBM DRAM That 3D Stacks Memory On Compute - Wccftech
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wccftech.com 2026-08-24
2026-08-09
FMS 2026 Signals the Next AI Memory War: Tiered Memory, zHBM, and Advanced Packaging - semivision
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news.google.com 2026-08-09
2026-08-08
Samsung zHBM Stacks Memory on the GPU. Has HBM Run Out of Beachfront? - futurumgroup.com
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news.google.com 2026-08-08
2026-08-06
Samsung Tackles the Memory & Storage Wall With 400+ Layer “Hybrid Bonded” V10 BV-NAND & zHBM That Stacks HBM Directly On Top of AI Chips - Wccftech
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wccftech.com 2026-08-06
2026-08-05
Samsung Unveils zHBM to Lead Big Tech AI Chip Market - Seoul Economic Daily
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news.google.com 2026-08-05
2026-08-05
Samsung stacks HBM directly on the AI chip: zHBM aims to significantly surpass HBM5 - igor´sLAB
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www.igorslab.de 2026-08-05
2026-08-05
Samsung previews zHBM stacked-on-logic concept, 400-layer bonded NAND at FMS 2026
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digitimes.com 2026-08-05
2026-08-05
Samsung, SK Hynix Unveil zHBM, HBF - 조선일보
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www.chosun.com 2026-08-05
2026-08-05
[Spotlight] Samsung Electronics Unveils a Surprise Data Innovation From “Horizontal Move (HBM)” to “Vertical Move (zHBM) Technology” - justeconomix.com
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www.justeconomix.com 2026-08-05
2026-08-04
Samsung Electronics Set to Unveil 'zHBM' Stacking HBM on GPU, Targeting AI Bottleneck Breakthrough - finance.biggo.com
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finance.biggo.com 2026-08-04